05-08-1738

PD Package
16-Lead Plastic UTQFN (3mm × 3mm)
(Reference LTC DWG #05-08-1738 Rev Ø)
0.70 ± 0.05
3.50 ± 0.05
(4 SIDES)
1.50 REF
2.10 ± 0.05
1.45 ± 0.05
1.45 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.55 ± 0.05
R = 0.05
TYP
15
0.40 ± 0.10
1
1.45 ± 0.10
3.00 ± 0.10
16
1.50 REF
2
1.45 ± 0.10
(PD16) UTQFN 1106 REV Ø
0.125 REF
0.25 ± 0.05
0.00 – 0.05
0.50 BSC
NOTE:
BOTTOM
VIEW—EXPOSED
PAD
1. DRAWING CONFORMS TO JEDEC PACKAGE VARIATION (TBI)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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