2410revC1

Features
■ Patented Multi-stage protection (MSP®)
■ Meets test requirements of Telcordia
■ Balanced TRIGARD®
■ Patented Switch-Grade Fail-Short Device
■ Quick response and high energy handling
■ Ideal for high-speed networks in high
exposure environments
■
Listed per UL 497 (File: 53117)
■
■
■
■
GR 974, GR1361, SBC SR 5165 and
RUS PE-80
Telcordia Analysis report DA-1547
Solid brass, gold-plated pins
Test point access option
Sealed option for harsh environments
2410 Series - 5-Pin Multi-Stage Protector (MSP®)
Bourns® 5-Pin Multi-Stage Protector (MSP®) is the latest generation telecommunications protector for high performance and long life
in overvoltage protection of copper pair voice-band and high-speed data circuits. Bourns MSP® combines the advantages of gas tube
and solid state protection while integrating three advanced technologies: a proprietary high-efficiency gas discharge tube,
precision matched metal oxide varistors and a patented Switch-Grade Fail-Short mechanism. The Switch-Grade Fail-Short
mechanism ensures superior thermal protection with fast acting, highly reliable response to thermal overload conditions. This
combined technology provides lower capacitance, higher reliability and longer life than competitive hybrid technologies.
Bourns® 2410 can be used universally for POTS and high speed data, e.g. ISDN, ADSL, ADSL2+, VDSL, VDSL2, other xDSL
protocols and high speed Ethernet. Bourns® MSP® technology provides unparalleled overvoltage protection with low loss on paired
copper communications circuits. The 2410 series is the most economical, reliable and effective choice for overvoltage protection of
copper pair circuits.
Characteristics
Test Methods per UL 497, CSA C22.2, Telcordia GR 974, 1361 and SBC SR 5165.
DC Breakdown ............................................................................................................................................... 300-400 V
AC Breakdown @ 60 Hz ................................................................................................................................ 300-400 V
Impulse Breakdown
100 V/μs .................................................................................................................................................... 600 V
1000 V/μs .................................................................................................................................................. 650 V
Insulation Resistance @ 100 Vdc .................................................................................................................. >1 GΩ
Insertion Loss @ 100 MHz ............................................................................................................................. <0.4 dB1
Return Loss @ 100 MHz ................................................................................................................................ >14 dB1
Capacitance Tip to Ring @ 1 MHz ................................................................................................................. 10 pF typical
Capacitance Tip or Ring to Ground @ 1 MHz ................................................................................................ 20 pF typical
Impulse Reset 5
52 V, 260 mA ............................................................................................................................................. <10 ms
135 V, 200 mA ........................................................................................................................................... <10 ms
150 V, 200 mA ........................................................................................................................................... <150 ms
Impulse Life Characteristics (Tip and Ring to Ground Simultaneously)
10 to 100 A, 10/1000 μs ............................................................................................................................ >3000 operations2
300 A, 10/1000 μs ..................................................................................................................................... >1000 operations2
500 A, 10/1000 μs ..................................................................................................................................... >1000 operations4
2,000 A, 10/250 μs .................................................................................................................................... >100 operations2
5,000 A, 20/100 μs .................................................................................................................................... >10 operations2
20,000 A, 8/20 μs ...................................................................................................................................... >10 operations4
AC Life Characteristics (Tip and Ring to Ground Simultaneously)
0.5 A rms continuous ................................................................................................................................. >30 seconds
1 A rms, 1 second, 600 ft. cable ................................................................................................................ >60 seconds
1 A rms, 1 second, 1 mile cable ................................................................................................................. >60 operations
10 A rms, 1 second .................................................................................................................................... >5 operations
65 A rms, 11 cycles .................................................................................................................................... >1 operation3
120 A rms, 0.1 second ............................................................................................................................... 1 operation
High Current Capability and Thermal Operation (Tip and Ring to Ground,
Vented or Non-Vented Gas Tube) .................................................................................................................. >30 A rms, simultaneously
Storage and Operating Temperature .............................................................................................................. -55 to +85 °C
Telcordia analyzed for controlled (non-sealed) and uncontrolled, high-exposure (sealed) environments per GR 974 and SBC SR 5165.
Telcordia Technical Analysis Report DA-1547.
Notes:
1
Tested according to Category 5 requirements
2
Exceeds Telcordia (Bellcore) GR 1361
3
Surpasses Telcordia GR 974
4
RUS (REA) PE-80
5
Network applied
Line to Line voltage is approximately 1.8 to 2 times the stated Line to Ground breakdown voltage.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
2410 Series - 5-Pin Multi-Stage Protector (MSP®)
How To Order
2410 - X XX - X - XXX - XX
Model Number Designator
Module Length
3 = Standard: 52.37 mm (2.06 in.)
7 = Special Short: 41.19 mm (1.62 in.)
Housing Color/Circuit Type
1 = Black/Standard
3 = Red/Special
6 = Blue/Standard
10 = Yellow/Standard
9 = Orange/Standard Service (non-Bridgelifter)
Pin Plating
G = Gold Plated
N = Tin Plated
Protector Type
MSP® = Multi-Stage Protector
BC = Balanced Capacitance*
Special Options
S = Sealed Case
T = Test Points**
ST = Sealed Case and Test Points**
*For use on DSL Systems that require balanced capacitance of ≤1 pF.
**T and ST options are not available on 2410-7x short module.
Product Dimensions
2410-3 MODULE
42.17
(1.66)
12.8
(0.50)
DIA.
29.9
(1.18)
2.2
2 PLCS.
(.085)
DIA.
2.3
5 PLCS.
(.092)
5.7
(0.223)
19.0
(0.75)
11.2
(0.44)
5.1
(0.20)
3.6
(0.14)
10.2
(0.40)
5.6
(0.220)
11.2
(0.440)
6.1
(0.240)
2410-7 MODULE
DIMENSIONS:
30.99
(1.22)
MM
(INCHES)
24.9
(0.98)
6.15
(0.24)
5.1
(0.20)
10.2
(0.40)
REV. O 04/15
“MSP” and “TRIGARD” are registered trademarks of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Similar pages