PANASONIC 2SB1071

Power Transistors
2SB1071, 2SB1071A
Silicon PNP epitaxial planar type
For low-voltage switching
16.7±0.3
• Low collector-emitter saturation voltage VCE(sat)
• High-speed switching
• Full-pack package which can be installed to the heat sink with one screw
5.5±0.2
2.7±0.2
7.5±0.2
■ Features
4.2±0.2
4.2±0.2
0.7±0.1
Unit: mm
10.0±0.2
φ 3.1±0.1
Collector-base voltage
(Emitter open)
Symbol
2SB1071
Rating
Unit
−40
VCBO
V
1.4±0.1
Solder Dip
(4.0)
Parameter
14.0±0.5
■ Absolute Maximum Ratings TC = 25°C
0.8±0.1
−50
2SB1071A
0.5+0.2
–0.1
2.54±0.3
−20
V
Collector-emitter voltage 2SB1071
(Base open)
2SB1071A
VCEO
Emitter-base voltage (Collector open)
VEBO
−5
V
Collector current
IC
−4
A
Peak collector current
ICP
−8
A
Collector power dissipation
PC
25
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
5.08±0.5
1: Base
2: Collector
3: Emitter
EIAJ: SC-67
TO-220F-A1 Package
−40
Ta = 25°C
1.3±0.2
1 2 3
2
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage
(Base open)
2SB1071
Collector-base cutoff
current (Emitter open)
2SB1071
Conditions
VCEO
IC = −10 mA, IB = 0
ICBO
VCB = −40 V, IE = 0
Typ
Max
−20
Unit
V
−40
2SB1071A
−50
VCB = −50 V, IE = 0
−50
IEBO
VEB = −5 V, IC = 0
−50
2SB1071A
Emitter-base cutoff current (Collector open)
Min
µA
µA
hFE1
VCE = −2 V, IC = − 0.1 A
45
hFE2 *
VCE = −2 V, IC = −1 A
60
Collector-emitter saturation voltage
VCE(sat)
IC = −2 A, IB = − 0.1 A
− 0.5
V
Base-emitter saturation voltage
VBE(sat)
IC = −2 A, IB = − 0.1 A
−1.5
V
Forward current transfer ratio

260
Transition frequency
fT
VCE = −5 V, IC = − 0.5 A, f = 10 MHz
150
MHz
Turn-on time
ton
IC = −2 A, IB1 = − 0.2 A, IB2 = 0.2 A
0.3
µs
Storage time
tstg
VCC = −20 V
0.4
µs
0.1
µs
Fall time
tf
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
R
Q
P
hFE2
60 to 120
90 to 180
130 to 260
Publication date: February 2003
SJD00041AED
1
2SB1071, 2SB1071A
30
(1)
20
10
VCE(sat)  IC
−100
IB=–80mA
−5
Collector current IC (A)
Collector power dissipation PC (W)
IC  VCE
−6
(1)TC=Ta
(2)With a 100×100×2mm
Al heat sink
(3)Without heat sink
(PC=2.0W)
TC=25˚C
–50mA
–45mA
–40mA
−4
–35mA
–30mA
−3
–25mA
–20mA
−2
–15mA
(2)
–10mA
−1
–5mA
(3)
0
0
25
50
75
100
125
0
150
Ambient temperature Ta (°C)
−2
0
−1 000
−10
− 0.1
− 0.01
− 0.01
− 0.1
−1
fT  I C
1 000
VCE=–2V
VCE=–2V
f=10MHz
TC=25˚C
25˚C
−100
TC=–25˚C
25˚C
100˚C
−1
− 0.01
− 0.01
− 0.1
−1
−10
–25˚C
−10
−1
− 0.1
− 0.01
Collector current IC (A)
− 0.1
−1
−10
ton , tstg , tf  IC
Safe operation area
−100
Collector current IC (A)
Pulsed tw=1ms
Duty cycle=1%
IC/IB=10
(–IB1=IB2)
VCC=–20V
TC=25˚C
1
ton
tstg
tf
Non repetitive pulse
TC=25˚C
−10 ICP
t=1ms
IC
t=300ms
−1
t=10ms
0
−2
−4
−6
Collector current IC (A)
−8
−10
2SB1071A
− 0.01
−1
2SB1071
− 0.1
0.01
−100
−1 000
Collector-emitter voltage VCE (V)
SJD00041AED
100
10
1
0.1
− 0.01
− 0.1
−1
Collector current IC (A)
Collector current IC (A)
10
0.1
Transition frequency fT (MHz)
−10
−10
Collector current IC (A)
TC=100˚C
Forward current transfer ratio hFE
Base-emitter saturation voltage VBE(sat) (V)
−8
TC=100˚C
25˚C
–25˚C
−1
hFE  IC
IC/IB=20
− 0.1
Turn-on time ton , Storage time tstg , Fall time tf (µs)
−6
IC/IB=20
−10
Collector-emitter voltage VCE (V)
VBE(sat)  IC
−100
2
−4
Collector-emitter saturation voltage VCE(sat) (V)
PC  Ta
40
−10
2SB1071, 2SB1071A
Rth  t
Thermal resistance Rth (°C/W)
102
(1)Without heat sink
(2)With a 100×100×2mm Al heat sink
(1)
(2)
10
1
10−1
10−2
10−4
10−3
10−2
10−1
1
10
102
103
104
Time t (s)
SJD00041AED
3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
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2002 JUL