CDMSP10 0504M

PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
Applications
RoHS compliant*
Protects four I/O lines
Ultra-low capacitance ~ 0.55 pF
ESD protection >30 kV
Surge protection
■
■
■
■
■
High Definition Multimedia Interface
(HDMI)
Digital Visual Interface (DVI)
Ethernet 10/100/1000 Mb/s
SATA interface
Portable electronics
CDMSP10-0504M – Surface Mount TVS Diode Array
General Information
The CDMSP10-0504M device provides ESD, EFT and Surge protection
for high speed data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4
(EFT) and IEC 61000-4-5 (Surge) requirements. The Transient Voltage
Suppressor array, protecting up to 4 data lines, offers a Working Peak
Reverse Voltage of 5 V and Minimum Breakdown Voltage of 6 V.
Line 1
NC
Line 2
NC
VDD
The MSOP-10L packaged device will mount directly onto the industry
standard MSOP-10L footprint. Bourns® Chip Diodes conform to JEDEC
standards, are easy to handle with standard pick and place equipment
and their flat configuration minimizes roll away.
GND
Line 3
NC
Line 4
NC
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Value
Unit
Operating Supply Voltage
VDC
6
V
DC Voltage at any I/O Pin
VD
(Gnd - 0.5) to (Vdd + 0.5)
V
ESD Performance per IEC 61000-4-2 (I/O Pins)
Air Discharge
Contact Discharge
VESDI/O
VESDI/O
19
12
kV
kV
ESD Performance per IEC 61000-4-2 (VDD, GND Pins)
Air Discharge
Contact Discharge
VESDPW
VESDPW
30
30
kV
kV
Storage Temperature
TSTG
-55 ˚C to +150 ˚C
˚C
Operating Temperature
TOPR
-55 ˚C to +150 ˚C
˚C
How To Order
Typical Part Marking
CD MSP10 - 05 04M
Common Code
CD = Chip Diode
Package
MSP10 = MSOP-10 Package
Working Peak Reverse Voltage
05 = 5 VRWM (Volts)
Number of Lines
04M = 4 Data Lines
CDMSP10-0504M ....................................................................B0504
Schematic
3
1
8
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2
4
5
CDMSP10-0504M – Surface Mount TVS Diode Array
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Maximum
Unit
VRWM
5
V
ID
5
µA
Channel Leakage Current @ VRWM
ICD
1
µA
Reverse Breakdown Voltage @ VRWM
VBR
9
V
1
V
Reverse Standoff Voltage
1
1
Leakage Current @ VRWM
3
Forward Voltage @ IF = 15 mA
Minimum
Nominal
6
VF
0.8
ESD Clamping Voltage
@ IEC 61000-4-2 +6 kV, Contact Mode
VC
12.5
V
ESD Clamping Voltage1
@ IEC 61000-4-2 +6 kV, Contact Mode
VC
9.5
V
Rdyn_io
0.33
Ohms
Rdyn_VDD
0.16
Ohms
CIN-1
0.55
0.65
pF
CIN-2
0.70
0.80
pF
Channel to Channel Input Capacitance - 1
@ VPIN3=5 V, VIN=2.5 V, f = 1 MHz
(Between channel pins)
CCROSS-1
0.08
0.09
pF
Channel to Channel Input Capacitance - 2
@ VPIN3=N/C, VIN=2.5 V, f = 1 MHz
(Between channel pins)
CCROSS-2
0.10
0.11
pF
Variation of Channel Input Capacitance - 1
@ VPIN3=5 V, VIN=2.5 V, f = 1 MHz
(Channel x Pin to GND, Channel y Pin to GND)
∆CIN-1
0.04
0.06
pF
Variation of Channel Input Capacitance - 2
@ VPIN3=N/C, VIN=2.5 V, f = 1 MHz
(Channel x Pin to GND, Channel y Pin to GND)
∆CIN-2
0.05
0.08
pF
2
ESD Dynamic Turn-On Resistance - I/O2
ESD Dynamic Turn-On Resistance - VDD
1
2
Channel Input Capacitance - 1
@ VPIN3=5 V, VIN=2.5 V, f = 1 MHz
Channel Input Capacitance2 - 2
@ VPIN3=N/C, VIN=2.5 V, f = 1 MHz
Notes:
1. Test from Vdd Pin 3 to Gnd Pin 8
2. Test from Pin 1,2,4 or 5 to Gnd Pin 8
3. Test from Gnd Pin 8 to Vdd Pin 3
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDMSP10-0504M – Surface Mount TVS Diode Array
Product Dimensions
Recommended Footprint
This is a molded JEDEC MSOP-10L package with lead free 100 %
Matte Sn on the lead frame. It weighs approximately 7 mg and has
a flammability rating of UL 94V-0.
4.8
(.189)
2.90 - 3.10
(0.114 - 0.122)
10
6
5.8
(.228)
1.0
(.039)
4.70 - 5.10
(0.185 - 0.201)
0.3
(.012)
0.50
(.002)
1
5
INDEX
AREA
This LAND LAYOUT is for reference purposes only. Please consult
your manufacturing partners to ensure your company’s PCB design
guidelines are met.
0.81 - 1.12
(0.032 - 0.044)
0.05 - 0.15
(0.002 - 0.006)
SEATING PLANE
0.15 - 0.30
(0.006 - 0.012)
0.50
(0.020)
TYP.
2.90 - 3.10
(0.114 - 0.122)
This ESD protection device is ideal in high speed data port
protection such as HDMI where capacitance per line is critical
parameter. See example connection below.
6
5
TMDS_GND
7
4
TMDS_D2-
8
TMDS_D1+
0.13 - 0.23
(0.005 - 0.009)
TMDS_D2+
TMDS_D2+
TMDS_D2-
0°~8°
ALL LEADS
5 ° ~ 15 °
4 PLCS.
Typical Application
C=100 nF (optional)
GND
+6 V
3
9
2
10
1
TMDS_D1-
TMDS_GND
0.40 - 0.66
(0.016 - 0.26)
DIMENSIONS = MILLIMETERS
(INCHES)
TMDS_D1TMDS_D0+
6
TMDS_GND
7
TMDS_D0-
5
4
TMDS_GND
TMDS_CK-
TMDS_D0+
TMDS_D0C=100 nF (optional)
8
GND
+6 V
3
9
2
10
1
TMDS_CK+
TMDS_CK+
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TMDS_D1+
TMDS_CK-
CDMSP10-0504M – Surface Mount TVS Diode Array
Characteristic Curves
9
6
3
0
-3
-6
-9
-12
-15
-18
-21
-24
-27
-30
Insertion Loss S21 (I/O-to-GND)
VDD = 5 V
3 GHz -0.455 dB
3.45 GHz -3 dB
Insertion Loss (dB)
Insertion Loss (dB)
Insertion Loss S21 (I/O-to-GND)
1θ+8
1θ+9
9
6
3
0
-3
-6
-9
-12
-15
-18
-21
-24
-27
-30
VDD = floated
2.9 GHz -3 dB
1θ+8
1θ+9
Frequency (Hz)
Frequency (Hz)
Analog Cross Talk
Analog Cross Talk
40
VDD = 5 V
20
Analog Cross Talk (dB)
Analog Cross Talk (dB)
40
0
-20
-40
-60
-80
-100
1θ+8
VDD = floated
20
0
-20
-40
-60
-80
-100
1θ+9
1θ+8
1θ+9
Frequency (Hz)
Frequency (Hz)
Transmission Line Pulsing (TLP) Measurement
Transmission Line Pulsing (TLP) Measurement
18
Transmission Line Pulsing (TLP)
Current (A)
Transmission Line Pulsing (TLP)
Current (A)
18
16
14
12
10
8
6
4
I/O to GND
2
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
Transmission Line Pulsing (TLP) Voltage (V)
16
14
12
10
8
6
4
VDD to GND
2
0
0
1
2
3
4
5
6
7
8
9
10
Transmission Line Pulsing (TLP) Voltage (V)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
CDMSP10-0504M – Surface Mount TVS Diode Array
Characteristic Curves
Typical Variation of CIN vs. VIN
Capacitance (pF)
0.8
1.0
0.9
VDD = 5 V, GND = 0 V, f = 1 MHz, T = 25 °C
0.8
Capacitance (pF)
1.0
0.9
Typical Variation of CIN vs. VIN
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
VDD = floated, GND = 0 V, f = 1 MHz, T = 25 °C
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.0
4.0
0.5
1.0
Voltage (V)
Capacitance (pF)
Capacitance (pF)
0.08
0.07
0.06
VDD = 5 V, GND = 0 V, f = 1 MHz, T = 25 °C
0.03
0.02
0.01
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Typical Variation of CIO-to-IO vs. VIN
0.10
0.09
0.04
2.0
Voltage (V)
Typical Variation of CIO-to-IO vs. VIN
0.05
1.5
2.5
3.0
3.5
4.0
Voltage (V)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
0.15
0.14
0.13
0.12
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0.0
VDD = floated, GND = 0 V, f = 1 MHz, T = 25 °C
0.5
1.0
1.5
2.0
2.5
Voltage (V)
3.0
3.5
4.0
CDMSP10-0504M – Surface Mount TVS Diode Array
Packaging Information
The product will be dispensed in tape and reel format (see diagram below).
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
Leader
.......
.......
10 pitches (min.)
.......
.......
10 pitches (min.)
W1
Start
Devices are packed in accordance with EIA standard
RS-481-A.
Direction of Feed
DIMENSIONS:
Item
Symbol
Overall Tape Thickness
T
Tape Width
W
Reel Width
W1
MSOP-10L
5.5 ± 0.10
(0.216 ± 0.004)
3.5 ± 0.10
(0.138 ± 0.004)
1.5 ± 0.10
(0.059 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
178
(7.008)
50.000000
MIN.
(1.969)
13.0 ± 0.20
(0.512 ± 0.008)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
8.00 ± 0.10
(0.314 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
12.0 ± 0.20
(0.470 ± 0.008)
14.4
(0.567)
--
3000
Carrier Width
A
Carrier Length
B
Carrier Depth
C
Sprocket Hole
d
Reel Outside Diameter
D
Reel Inner Diameter
D1
Feed Hole Diameter
D2
Sprocket Hole Position
E
Punch Hole Position
F
Punch Hole Pitch
P
Sprocket Hole Pitch
P0
Embossment Center
P1
Quantity per Reel
MM
(INCHES)
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
09/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Similar pages