CDSOT563 0502

PL
IA
NT
CO
M
*R
oH
S
Features
Applications
■ Lead free as standard
■ Personal Digital Assistant (PDAs)
■ RoHS compliant*
■ Mobile phones and accessories
■ Low capacitance - 2 pF
■ Portable electronics
■ ESD protection >15 kV
■ ADSL / VDSL cards
CDSOT563-0502 - Surface Mount TVS Diode Array
General Information
The CDSOT563-0502 device provides ESD and EFT protection for high speed data
ports meeting IEC 61000-4-2 (ESD) and IEC 61000-4-4 (EFT) requirements. The
Transient Voltage Suppressor array offers a Working Peak Reverse Voltage of 5 V and
Minimum Breakdown Voltage of 6 V.
I/O 1
VDD
I/O 2
6
5
4
The SOT563 packaged device will mount directly onto the industry standard SOT563
footprint. Bourns® Chip Diodes are easy to handle with standard pick and place
equipment and the flat configuration minimizes roll away.
1
2
3
I/O 1
GND
1/O 2
Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Peak Pulse Current
IPPM
6
A
Storage Temperature
TSTG
-55
+25
+150
°C
Operating Temperature
TOPR
VWM
-40
+25
+125
°C
5
V
Working Peak Voltage
Breakdown Voltage
Leakage Current @ VWM
Channel Leakage Current @
VWM
Forward Voltage
Clamping Voltage
Channel Input Capacitance
Channel Input Capacitance
Channel to Channel Input
Capacitance
Channel to Channel Input
Capacitance
(tp = 8/20 µs)
Unit
VBR
IL
9
V
Vpin5 = 5 V, Vpin2 = 0 V, Pin 5 to Pin 2
5
µA
ICH
Vpin5 = 5 V, Vpin2 = 0 V, Any I/O to Pin 2
1
µA
1
V
VF
Vclamp_VDD
CIN-1
CIN-2
CCROSS-1
CCROSS-2
@ 1 mA, Pin 5 to Pin 2
@ If =15 mA
IPP = 5 A, tp = 8/20µs
Vpin5 = 5 V, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz
6
0.8
9
V
2
2.5
pF
Vpin5 = floated, Vpin2 = 0 V, VIN = 2.5 V, f = 1
MHz
2.8
3.6
pF
Vpin5 = 5 V, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz
0.4
0.5
pF
Vpin5 = floated, Vpin2 = 0 V, VIN = 2.5 V, f = 1
MHz
0.55
0.65
pF
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
CDSOT563-0502 - Surface Mount TVS Diode Array
Product Dimensions
Recommended Footprint
This is a molded SOT563 package with lead free 100 % Matte Sn
on the lead frame. It weighs approximately 3 mg and has a
flammability rating of UL 94V-0.
0.51
(0.020)
TYP.
0.10 - 0.30
(0.004 - 0.012)
6
5
0.30
(0.012)
TYP.
1.02
(0.040)
TYP.
0.50 - 0.60
(0.020 - 0.024)
1.50 - 1.70
(0.059 - 0.067)
0.51
TYP.
(0.020)
4
1.10 - 1.30
(0.043 - 0.051)
1.40
TYP.
(0.055)
1.50 - 1.70
(0.059 - 0.067)
Typical Part Marking
1
0.50
(0.020)
BSC
2
3
0.17 - 0.27
(0.007 - 0.011)
DIMENSIONS = MILLIMETERS
(INCHES)
CDSOT563-0502 ......................................................................52XY
(“X” = Date Code; “Y” = Package House)
0.08 - 0.16
(0.003 - 0.007)
How to Order
CD SOT563 - 05 02
Common Diode
Chip Diode
Package
SOT563 = SOT-563 Package
Working Peak Reverse Voltage
05 = 5 V (Volts)
Data Lines
02 = 2 Data Lines
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
CDSOT563-0502 - Surface Mount TVS Diode Array
Rating & Characteristic Curves
12
11
10
9
8
7
6
5
4
3
2
1
0
Pulse Waveform
I/O Pin to GND Pin
VDD Pin to GND Pin
Percent of IPP
Clamping Voltage (V)
Clamping Voltage vs. Peak Pulse Current
Waveform
Parameters:
tr = 8 µs
td = 20 µs
4.5
5.0
5.5
6.0
6.5
110
100
90
80
70
60
50
40
30
20
10
0
7.0
Waveform
Parameters
tt = 8 µs
td = 20 µs
et
td = t|IPP/2
5
0
10
15
Peak Pulse Current (A)
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
25
30
Typical Variation of CIN vs. VIN
4.0
3.5
VDD Pin to GND Pin
I/O Pin to GND Pin
Waveform
Parameters:
tr = 8 µs
td = 20 µs
4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 6.2 6.4 6.6 6.8 7.0
Peak Pulse Current (A)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Input Capacitance (pF)
Forward Clamping Voltage (V)
Forward Clamping Voltage vs. Peak Pulse Current
20
Time (µs)
VDD = floated
3.0
2.5
2.0
VDD = 5 V
1.5
1.0
f = 1 MHz,
T = 25 °C
0.5
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage (V)
3.5
4.0
4.5 5.0
CDSOT563-0502 - Surface Mount TVS Diode Array
Packaging Information
The product will be dispensed in tape and reel format (see diagram below)
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
SOT563
Carrier Width
A
1.78 ± 0.05
(0.069 ± 0.002)
Carrier Length
B
1.78 ± 0.05
(0.069 ± 0.002)
Carrier Depth
C
0.69 ± 0.05
(0.027 ± 0.002)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
MM
(INCHES)
--
Devices are packed in accordance with EIA standard
RS-481-A.
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
14.4
MAX.
(0.567)
3000
REV. 09/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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