Data Sheet

74AHC1G09-Q100
2-input AND gate with open-drain output
Rev. 2 — 16 August 2012
Product data sheet
1. General description
The 74AHC1G09-Q100 is a high-speed Si-gate CMOS device.
The 74AHC1G09-Q100 provides the 2-input AND function with open-drain output.
The output of the 74AHC1G09-Q100 is an open drain and can be connected to other
open-drain outputs to implement active-LOW, wired-OR or active-HIGH wired-AND
functions. For digital operation, this device must have a pull-up resistor to establish a logic
HIGH level.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 High noise immunity
 Low power dissipation
 SOT353-1 and SOT753 package options
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
74AHC1G09GW-Q100 40 C to +125 C
74AHC1G09GV-Q100
40 C to +125 C
Description
Version
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74AHC1G09-Q100
NXP Semiconductors
2-input AND gate with open-drain output
4. Marking
Table 2.
Marking
Type number
Marking code
74AHC1G09GW-Q100
A9
74AHC1G09GV-Q100
A09
5. Functional diagram
Y
A
B
A
1
4
2
1
Y
001aad598
Fig 1.
&
2
Logic symbol
4
GND
B
001aad599
Fig 2.
001aad600
IEC logic symbol
Fig 3.
Logic diagram
6. Pinning information
6.1 Pinning
$+&*4
%
$
*1'
9&&
<
DDD
Fig 4.
Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A)
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
B
1
data input B
A
2
data input A
GND
3
ground (0 V)
Y
4
data output Y
VCC
5
supply voltage
74AHC1G09_Q100
Product data sheet
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2-input AND gate with open-drain output
7. Functional description
Table 4.
Function table[1]
Input
Output
A
B
Y
L
L
L
L
H
L
H
L
L
H
H
Z
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
[1]
output voltage
VO
Conditions
Min
Max
Unit
0.5
+7.0
V
0.5
+7.0
V
active mode
[1]
0.5
+7.0
V
high-impedance mode
[1]
0.5
+7.0
V
-
20
mA
-
20
mA
-
25
mA
75
mA
IIK
input clamping current
VI < 0.5 V
[1]
IOK
output clamping current
VO < 0.5 V
[1]
IO
output current
VO > 0.5 V
ICC
supply current
-
IGND
ground current
-
75
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
Tamb = 40 C to +125 C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating operations
Symbol
Parameter
Min
Typ
Max
Unit
VCC
supply voltage
2.0
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
active mode
0
-
VCC
V
high-impedance mode
0
-
6.0
V
Tamb
ambient temperature
40
+25
+125
C
t/V
input transition rise and fall rate VCC = 3.0 V to 3.6 V
-
-
100
ns/V
VCC = 4.5 V to 5.5 V
-
-
20
ns/V
74AHC1G09_Q100
Product data sheet
Conditions
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2-input AND gate with open-drain output
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
Min
VIH
VIL
VOL
HIGH-level
input voltage
LOW-level
input voltage
40 C to +85 C 40 C to +125 C Unit
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
10.0
A
II
input leakage
current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
IOZ
OFF-state
VI = VIH or VIL; VO = VCC or
output current GND; VCC = 5.5 V
-
-
0.25
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
20
A
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
2.5
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; for test circuit see Figure 6.
Symbol Parameter
25 C
Conditions
Min
tpd
Min
Max
Min
Max
-
4.6
7.5
1.0
8.5
1.0
9.0
ns
-
6.5
11.0
1.5
12.0
1.5
12.5
ns
CL = 15 pF
-
3.2
5.5
1.0
6.5
1.0
7.0
ns
CL = 50 pF
-
4.6
7.5
1.5
8.0
1.5
8.5
ns
-
5
-
-
-
-
-
pF
[1]
propagation delay A and B to Y;
see Figure 5
VCC = 3.0 V to 3.6 V
[2]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
CPD
power dissipation
capacitance
CL = 50 pF; fi = 1 MHz;
VI = GND to VCC
[1]
tpd is the same as tPZL and tPLZ.
[2]
Typical values are measured at VCC = 3.3 V.
74AHC1G09_Q100
Product data sheet
40 C to +85 C 40 C to +125 C Unit
Typ Max
[3]
[4]
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2-input AND gate with open-drain output
[3]
Typical values are measured at VCC = 5.0 V.
[4]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = dissipation due to the output if the combination of the pull-up voltage and resistance results in VCC at the output.
12. Waveforms
VI
A, B input
VM
GND
t PLZ
t PZL
VCC
Y output
VM
VX
VOL
001aad602
Measurement points are given in Table 9.
VOL is the typical voltage output level that occurs with the output load.
Fig 5.
The data input (A, B) to output (Y) propagation delays
Table 9.
Measurement points
Input
Output
VM
VM
VX
0.5VCC
0.5VCC
VOL + 0.3 V
S1
VCC
PULSE
GENERATOR
VI
RL =
1000 Ω
VO
VCC
open
GND
D.U.T.
RT
CL
mna232
Test data is given in Table 10.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 6.
Test circuit for measuring switching times
74AHC1G09_Q100
Product data sheet
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2-input AND gate with open-drain output
Table 10.
Test data
Input
Load
S1
VI
tr, tf
RL
CL
tPHZ, tPZH
tPLZ, tPZL
tPLH, tPHL
GND to VCC
 3.0 ns
1000 
15 pF
GND
VCC
open
GND to VCC
 3.0 ns
1000 
50 pF
GND
VCC
open
74AHC1G09_Q100
Product data sheet
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Rev. 2 — 16 August 2012
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2-input AND gate with open-drain output
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
Fig 7.
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Package outline SOT353-1 (TSSOP5)
74AHC1G09_Q100
Product data sheet
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Rev. 2 — 16 August 2012
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7 of 12
74AHC1G09-Q100
NXP Semiconductors
2-input AND gate with open-drain output
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT753
Fig 8.
JEITA
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Package outline SOT753 (SC-74A)
74AHC1G09_Q100
Product data sheet
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2-input AND gate with open-drain output
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
MIL
Military
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AHC1G09_Q100 v.2
20120816
Product data sheet
-
74AHC1G09_Q100 v.1
-
-
Modifications:
74AHC1G09_Q100 v.1
74AHC1G09_Q100
Product data sheet
•
Features list corrected (errata).
20120807
Product data sheet
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
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In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC1G09_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 August 2012
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Product data sheet
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18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 4
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
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Date of release: 16 August 2012
Document identifier: 74AHC1G09_Q100