BGA Package 40-Lead (11.25mm × 6.25mm × 4.92mm) (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW Øb (40 PLACES) 2.540 1.270 0.3175 0.3175 1.270 2.540 3 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 4.445 DETAIL A 3.175 1.905 DIMENSIONS 0.635 0.000 0.635 1.905 3.4925 4 PACKAGE BOTTOM VIEW DETAIL B PACKAGE SIDE VIEW 0.000 ddd M Z X Y eee M Z 2.8575 F e 3.95 – 4.05 3.175 4.445 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.71 0.60 NOM 4.92 0.60 4.32 0.78 0.63 11.25 6.25 1.27 8.89 5.08 MAX 5.12 0.70 4.42 0.85 0.66 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE COMPONENT PIN “A1” 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 40 TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 40 0510 REV Ø