05-08-1867

BGA Package
40-Lead (11.25mm × 6.25mm × 4.92mm)
(Reference LTC DWG# 05-08-1867 Rev Ø)
A
aaa Z
E
Y
Z
DETAIL A
A2
X
G
SEE NOTES
PIN 1
3
A1
A
ccc Z
PIN “A1”
CORNER
B
4
b
D
b1
MOLD
CAP
D
C
F
E
SUBSTRATE
0.27 – 0.37
// bbb Z
aaa Z
G
H
DETAIL B
5
PACKAGE TOP VIEW
Øb (40 PLACES)
2.540
1.270
0.3175
0.3175
1.270
2.540
3
2
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
4.445
DETAIL A
3.175
1.905
DIMENSIONS
0.635
0.000
0.635
1.905
3.4925
4
PACKAGE BOTTOM VIEW
DETAIL B
PACKAGE SIDE VIEW
0.000
ddd M Z X Y
eee M Z
2.8575
F
e
3.95 – 4.05
3.175
4.445
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.71
0.60
NOM
4.92
0.60
4.32
0.78
0.63
11.25
6.25
1.27
8.89
5.08
MAX
5.12
0.70
4.42
0.85
0.66
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
COMPONENT
PIN “A1”
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 40
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 40 0510 REV Ø
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