05-08-1881

BGA Package
44-Lead (15mm × 15mm × 5.02mm)
(Reference LTC DWG # 05-08-1881 Rev A)
A
DETAIL A
Z
11
A2
aaa Z
SEE NOTES
10
9
8
7
6
5
4
3
2
7
1
PIN 1
A
PIN “A1”
CORNER
A1
4
b
B
ccc Z
C
D
E
b1
MOLD
CAP
F
D
F
SUBSTRATE
G
0.37 – 0.47
// bbb Z
3.95 – 4.05
H
DETAIL B
J
K
e
L
Øb (44 PLACES)
ddd M Z X Y
eee M Z
X
Y
aaa Z
E
3
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.350
0.630 ±0.025 Ø 44x
5.080
0.000
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
6.350
5.080
3.810
2.540
1.270
0.000
0.3175
1.270
0.3175
2.540
3.810
5.080
6.350
SEE NOTES
G
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
e
b
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.82
0.50
4.32
0.71
0.60
NOM
5.02
0.60
4.42
0.78
0.63
15.0
15.0
1.27
12.70
12.70
MAX
5.22
0.70
4.52
0.85
0.66
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 44
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 44 1212 REV A
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