05-08-1883

BGA Package
50-Lead (11.25mm × 9.00mm × 3.42mm)
(Reference LTC DWG # 05-08-1883 Rev A)
A
aaa Z
E
Y
X
Z
A2
A1
SEE NOTES
DETAIL A
7
G
SEE NOTES
PIN 1
3
ccc Z
A
PIN “A1”
CORNER
B
4
b
b1
MOLD
CAP
D
D
F
SUBSTRATE
E
H1
F
e
Z
H2
// bbb Z
C
G
DETAIL B
H
aaa Z
Øb (50 PLACES)
ddd M Z X Y
eee M Z
PACKAGE TOP VIEW
7
DETAIL B
PACKAGE SIDE VIEW
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
3.810
2.540
1.270
0.3175
0.3175
1.270
2.540
3.810
0.000
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
SUGGESTED PCB LAYOUT
TOP VIEW
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DIMENSIONS
4.445
0.630 ±0.025 Ø 50x
3
4.13
4.76
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.71
0.60
0.27
2.45
NOM
3.42
0.60
2.82
0.78
0.63
11.25
9.0
1.27
8.89
7.62
0.32
2.50
MAX
3.62
0.70
2.92
0.85
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 50
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 50 1212 REV A
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