05-08-1885

BGA Package
71-Lead (15mm × 9.00mm × 3.42mm)
(Reference LTC DWG # 05-08-1885 Rev A)
A
aaa Z
E
Y
Z
A2
X
SEE NOTES
DETAIL A
SEE NOTES
7
6
5
4
3
2
7
1
PIN 1
3
A
A1
PIN “A1”
CORNER
B
ccc Z
4
C
D
b
b1
MOLD
CAP
E
SUBSTRATE
D
G
Z
// bbb Z
F
F
H1
H2
H
DETAIL B
J
e
Øb (71 PLACES)
K
ddd M Z X Y
eee M Z
L
aaa Z
e
PACKAGE TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
6.350
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
3.810
2.540
1.270
0.3175
0.3175
1.270
2.540
3.810
0.000
DETAIL B
PACKAGE SIDE VIEW
0.630 ±0.025 Ø 71x
b
G
4.765
5.395
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.71
0.60
0.27
2.45
DIMENSIONS
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
NOM
3.42
0.60
2.82
0.78
0.63
15.0
9.0
1.27
12.7
7.62
0.32
2.50
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
MAX
3.62
0.70
2.92
0.85
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 71
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 71 1212 REV A
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