05-08-1880

BGA Package
144-Lead (15mm × 15mm × 5.01mm)
(Reference LTC DWG # 05-08-1880 Rev B)
D
X
A2
Y
SEE NOTES
DETAIL A
Z
A
aaa Z
G
e
7
b
M
L
b
A1
ccc Z
K
J
H
b1
MOLD
CAP
E
G
F
SUBSTRATE
4
E
Z
// bbb Z
H2
PIN “A1”
CORNER
F
H1
D
DETAIL B
C
Øb (144 PLACES)
B
e
A
ddd M Z X Y
eee M Z
aaa Z
12
SEE NOTES
PACKAGE TOP VIEW
DETAIL B
PACKAGE SIDE VIEW
11
3
10
9
8
7
6
5
4
3
2
1
PIN 1
PACKAGE BOTTOM VIEW
6.9850
5.7150
0.630 ±0.025 Ø 144x
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
15.00
15.00
1.27
13.97
13.97
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 144
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 144 1112 REV B
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