CGF0804

T
PL
IA
N
Applications
■ Combined Protection Technology (CPT)
■ USB 2.0
*R
oH
S
CO
M
Features
■
■
■
■
■
design
Common mode filter
ESD protection
Fast response time
Low capacitance
RoHS compliant*
■ HDMI
■ MIPI
■ MHL
ChipGuard® CGF Series ESD/EMI Filter
Description
The Bourns® ChipGuard® CGF Series utilizes Combined Protection Technology (CPT) to create an ESD protection device and
common mode filter in a single space-saving device. This series features very low capacitance and superior common mode noise
rejection, making it ideal for use in high-speed differential data lines.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter
Common Mode Impedance @100 MHz
Cut-off Frequency
DC Resistance
Insulation Resistance
Capacitance @ 1 MHz, Any Pin to Ground)
Clamping Voltage @ 60 ns after ESD Event
Leakage Current @ 5 V, Any Pin to Ground)
Min.
67.5
Typ.
90
3
2.7
1.8
10
Symbol
VDC
IDC
Unit
Ohms
GHz
Ohms
Megohms
pF
V
µA
3.5
0.6
20
1
Absolute Maximum Ratings @ 25 °C (unless otherwise noted)
Parameter
Rated Voltage
Rated Current
Max.
112.5
Rating
5
100
Circuit Diagram
4
Unit
V
mA
General Characteristics
3
GND
GND
Operating Temperature...........................................................................-40 °C to +85 °C
Storage Temperature ............................................................................-40 °C to +125 °C
Response Time........................................................................................................ <1 ns
Performance Standard ................................................................ IEC 61000-4-2, Level 4
1
2
How to Order
CG F 0804 TFH - 900 - 2L
®
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
ChipGuard
Product
Designator
Common Mode Filter
Designator
Package Dimension
Code
Technology
TFH = Thin Film High-Speed
Common Mode Impedance
@ 100 MHz (90x 100)
Lines
2L = 2 Line (0804 Package)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® CGF Series ESD/EMI Filter
Impedance vs. Frequency Characteristics
Insertion Loss vs. Frequency Characteristics
Test Instrument: HP4291A Impedance/Material Analyzer
Test Instrument: Agilent E4071C ENA-L Network Analyzer
Differential Mode
S21 (dB)
Impedance (Ohms)
Common Mode
Common Mode
Differential Mode
Frequency (MHz)
Frequency (MHz)
Product Dimensions
Recommended Pad Layout
0.15 ± 0.10
(.006 ± .004)
0.40 ± 0.10
(.016 ± .004)
4
0.65 ± 0.05
(.026 ± .002)
0.15 ± 0.10
(.006 ± .004)
0.21
(.008)
3
GND
0.097
(.004)
0.20 0.136
(.008) (.006)
GND
1
2
0.15 ± 0.10
(.006 ± .004)
0.10 ± 0.05
(.004 ± .002)
1.05
(.041)
0.121
(.005)
0.85 ± 0.05
(.033 ± .002)
DIMENSIONS:
0.50 ± 0.05
(.020 ± .002)
0.27 ± 0.10
(.011 ± .004)
0.55
(.022)
0.40
(.016)
MM
(INCHES)
4
GND
3
0.35
(.014)
GND
1
2
0.025
(.001)
0.27
(.011)
0.67
1.18 (.026)
(.046)
0.40 ± 0.10
(.016 ± .004)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® CGF Series ESD/EMI Filter
Solder Reflow Recommendations
TEMPERATURE OF TERMINATION
A
B
A
C
D
1st Rising
Temperature
The Normal to
Preheating
Temperature
30 s to 60 s
B
Preheating
140 °C to 160 °C
60 s to 120 s
C
2nd Rising
Temperature
Preheating to 200 °C
20 s to 40 s
D
Main Heating
if 220 °C
if 230 °C
if 240 °C
if 250 °C
if 260 °C
50 s ~ 60 s
40 s ~ 50 s
30 s ~ 40 s
20 s ~ 40 s
20 s ~ 40 s
E
Regular Cooling
200 °C to 100 °C
1 °C/s ~ 4 °C/s
E
Per J-STD-020C
TIME
Packaging Dimensions
8.0 ± 0.1
(.315 ± .004)
0.60 ± 0.03
(.024 ± .0012)
4.0 ± 0.10
(.157 ± .004)
DIA.
1.55 ± 0.05
(.061 ± .002)
13.0 ± 1.0
(.512 ± .039)
1.75 ± 0.05
(.069 ± .002)
2.0 ± 0.05
(.079 ± .002)
62.0 ± 1.5
(2.441 ± .059)
2.0 ± 0.5
(.079 ± .020)
13.0 ± 0.5
(.512 ± .020)
21.0 ± 0.8
(.827 ± .031)
2.0 ± 0.05
(.079 ± .002)
0.78 ± 0.03
(.031 ± .0012)
178 ± 2.0
(7.008 ± .079)
1.04 ± 0.03
(.041 ± .0012)
3.5 ± 0.05
(.138 ± 0.002)
9.0 ± 0.5
(.354 ± .020)
DIMENSIONS:
MM
(INCHES)
STANDARD = 10,000 pieces per reel
REV. B 08/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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