05-08-1835

PD Package
20-Lead Plastic UTQFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1835 Rev Ø)
0.70 ±0.05
3.50 ± 0.05
1.60 ± 0.05
2.10 ± 0.05
1.65 ±0.05
1.65 ±0.05
PACKAGE
OUTLINE
0.20 ±0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.55 ± 0.05
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
0.35 × 45°
CHAMFER
R = 0.10
TYP
19 20
0.40 ± 0.10
1
2
3.00 ± 0.10
1.60 REF
1.65 ±0.10
1.65 ±0.10
(PD20) UTQFN 0409 REV Ø
0.150 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.20 ± 0.05
0.40 BSC
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