05-08-1748

PF Package
24-Lead Plastic UTQFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1748 Rev Ø)
0.70 ± 0.05
2.45 ± 0.05
2.50 REF
4.50 ± 0.05
3.10 ± 0.05
2.45 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.55 ± 0.05
R = 0.05
TYP
R = 0.115
TYP
23 24
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
2.45 ± 0.10
4.00 ± 0.10
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
2
2.50 REF
2.45 ± 0.10
(PF24) UTQFN 0107
0.125 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
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