05-08-1778

DHD Package
18-Lead Plastic DFN (5mm × 4mm)
(Reference LTC DWG # 05-08-1778 Rev Ø)
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.44 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
4.34 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
5.00 ±0.10
(2 SIDES)
R = 0.125
TYP
10
4.00 ±0.10
(2 SIDES)
0.40 ± 0.10
18
2.44 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
PIN 1
NOTCH
9
0.200 REF
1
0.25 ± 0.05
0.50 BSC
4.34 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJGD-2) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
(DHD18) DFN 0710
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