LGA Package 144-Lead (15mm × 15mm × 4.41mm) (Reference LTC DWG # 05-08-1873 Rev A) aaa Z 15 BSC X 4.31 – 4.51 Y SEE NOTES DETAIL A 3x, C (0.22 x45°) 0.12 – 0.28 7 13.97 BSC M L K J H 15 BSC SUBSTRATE F E 1.27 BSC 0.36 – 0.46 PAD 1 CORNER G 13.97 BSC MOLD CAP 3.95 – 4.05 D Z bbb Z DETAIL B 4 C B A aaa Z PACKAGE TOP VIEW PADS SEE NOTES 0.630 ±0.025 SQ. 143x 11 10 9 8 7 6 5 4 3 2 PACKAGE BOTTOM VIEW DETAIL B 1 DIA 0.630 PAD 1 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 eee S X Y 12 3 6.9850 DETAIL A 5.7150 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 4.4450 3.1750 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.9050 3 LAND DESIGNATION PER JESD MO-222, SPP-010 0.6350 0.0000 0.6350 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.9050 LTMXXXXXX µModule 5. PRIMARY DATUM -Z- IS SEATING PLANE 3.1750 6. THE TOTAL NUMBER OF PADS: 144 4.4450 7 5.7150 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6.9850 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 144 1112 REV A