05-08-1770

UFEMA Package
26-Lead Plastic QFN (4mm × 6mm)
(Reference LTC DWG # 05-08-1770 Rev A)
0.70 ±0.05
4.50 ± 0.05
2.64 ± 0.05
2.64 ± 0.05
2.31 ± 0.05
3.10 ± 0.05
0.41 ± 0.05
2.18 ± 0.05
2.50 REF
2.36 ± 0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
2.55 ± 0.05
3.25 ± 0.05
4.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
0.75 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
R = 0.30 OR
0.35 × 45°
CHAMFER
R = 0.10
TYP
26
25
1
2.64 ± 0.10
2.18 ± 0.10
0.41 ± 0.10
4.50 REF
6.00 ± 0.10
2
R = 0.125
TYP
0.50 BSC
2.36 ± 0.10
2.31 ± 0.10
2.64 ± 0.10
0.25 ± 0.05
0.40 ± 0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
2.50 REF
BOTTOM VIEW—EXPOSED PAD
(UFE26MA) QFN 0608 REV A
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