05-08-1887

G Package
48-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1887 Rev A)
12.50 – 13.10*
(.492 – .516)
1.25 ±0.12
7.8 – 8.2
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
5.3 – 5.7
0.25 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 – 5.60*
(.197 – .221)
PARTING
LINE
0.10 – 0.25
(.004 – .010)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
2.0
(.079)
MAX
1.65 – 1.85
(.065 – .073)
0° – 8°
0.55 – 0.95**
(.022 – .037)
1.25
(.0492)
REF
NOTE:
1.DRAWING IS NOT A JEDEC OUTLINE
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSIONS ARE IN
0.50
BSC
7.40 – 8.20
(.291 – .323)
MILLIMETERS
(INCHES)
4. DRAWING NOT TO SCALE
5. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE
0.50
(.01968)
BSC
SEATING
PLANE
0.20 – 0.315†
(.008 – .0124)
TYP
*DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS,
BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT
THE PARTING LINE. MOLD FLASH SHALL NOT EXCEED .15mm PER SIDE
**LENGTH OF LEAD FOR SOLDERRING TO A SUBSTRATE
†THE MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS DO NOT EXCEED 0.13mm PER SIDE
0.05
(.002)
MIN
G48 (SSOP) 0814 REV A
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