G Package 48-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1887 Rev A) 12.50 – 13.10* (.492 – .516) 1.25 ±0.12 7.8 – 8.2 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 5.3 – 5.7 0.25 ±0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 – 5.60* (.197 – .221) PARTING LINE 0.10 – 0.25 (.004 – .010) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 2.0 (.079) MAX 1.65 – 1.85 (.065 – .073) 0° – 8° 0.55 – 0.95** (.022 – .037) 1.25 (.0492) REF NOTE: 1.DRAWING IS NOT A JEDEC OUTLINE 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSIONS ARE IN 0.50 BSC 7.40 – 8.20 (.291 – .323) MILLIMETERS (INCHES) 4. DRAWING NOT TO SCALE 5. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE 0.50 (.01968) BSC SEATING PLANE 0.20 – 0.315† (.008 – .0124) TYP *DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS, BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH SHALL NOT EXCEED .15mm PER SIDE **LENGTH OF LEAD FOR SOLDERRING TO A SUBSTRATE †THE MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS DO NOT EXCEED 0.13mm PER SIDE 0.05 (.002) MIN G48 (SSOP) 0814 REV A