MOV-07DxxxK

MATERIAL DECLARATION SHEET
Material Number
MOV-07DxxxK Series
Product Line
MOV Products
Compliance Date
RoHS Compliant
No.
1
2
3
4
Construction
Element
(subpart)
Disk body with
Silver electrode
1-Nov-2009
Yes
MSL
Homogeneous
Material
Epoxy Resin
(KAIHUA)
Lead wire
Tin Copper Clad
Steel Wire
(HUIHUA)
Solder
Material
weight
[mg]
Zinc Oxide Disc
(HEL)
Coater
1
Soldering Bar
(DONGYANG)
Total weight
180
130
150
40
Homogeneous Material\
Substances
if applicable
Materials
Mass %
Zinc Oxide (ZnO)
Silver (Ag)
1314-13-2
7440-22-4
86
1.8
Material
Mass % of
total unit
wt.
31.0
0.6
12018-01-8
1309-64-4
1304-76-3
1317-35-7
1313-99-1
1309-96-6
12.2
4.4
25036-25-3
50
13.0
60676-86-0
47
3
55
40
5
96.5
3
0.5
12.2
0.8
16.5
12.0
Other compound (includes
oxides of chromium, antimony,
bismuth, manganese, nickel,
cobalt - % is trade secret)
Epoxy resin (halogens
<1500ppm but >900 ppm)
Silica
Other compound
Iron (Fe)
Copper (Cu)
Tin (Sn)
Tin (Sn)
Silver (Ag)
Copper (Cu)
CASRN
7439-89-6
7740-50-8
7440-31-5
7440-31-5
7440-22-4
7440-50-8
Subpart
mass of
total wt.
(%)
36.0
26.0
30.0
1.5
7.7
0.24
0.04
8.0
500
This Document was updated on: 11/06/2009
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