cmfsd

PL
IA
NT
Features
CO
M
■ Two resistance-matched PTCs in a
*R
oH
S
ceramic housing
Model CMF-SD is currently available,
although not recommended for new
designs. Model CMF-SDP is
preferred.
■ Narrow resistance tolerance
■ RoHS compliant*
CMF-SD Series - Telecom CPTC Resettable Fuses
Electrical Characteristics
Model
CMF-SD10
CMF-SD25
CMF-SD25-10
CMF-SD35
CMF-SD35-10
CMF-SD35A
CMF-SD35A-10
CMF-SD50
CMF-SD50-10
CMF-SD50A
CMF-SD50A-10
Induction
Voltage
Withstand
VAC
600
600
600
600
600
600
600
600
600
600
600
Rated
Voltage
Volts
220
230
220
230
230
230
230
230
230
230
230
Rated
Resistance
(RN) @ 25 °C
Ohms Tolerance
10
±20 %
25
±20 %
25
±10 %
35
±20 %
35
±10 %
35
±20 %
35
±10 %
50
±20 %
50
±10 %
50
±20 %
50
±10 %
Resistance
Matching in
Housing
Ohms
±1.0
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
± 0.5
Hold
Current
Amps @ 25 °C
0.150
0.130
0.130
0.100
0.100
0.100
0.100
0.090
0.090
0.090
0.090
Trip
Current
Amps @ 25 °C
0.360
0.260
0.260
0.200
0.200
0.200
0.200
0.190
0.190
0.190
0.190
Imax @
230 VAC
Amps
1
2.8
2.5
3
3
2.5
2.5
3
3
3
3
Time to
Trip @
Imax / 230
VAC
Seconds
<4.5
< 0.3
< 0.3
< 0.2
< 0.2
< 0.2
< 0.2
< 0.1
< 0.1
< 0.1
< 0.1
Test Procedures And Requirements For Model CMF-SD Series
Primary
Test
Protection
Test Condition
Requirements
Mains Power Contact - ITU-T K.20, K.21.... None .............. 230 V rms, 10 ohms, 15 Min. .....................................................(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. .....(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 μs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. .................(Ri-Rf) / Ri < ±10 %
Lightning Surge ................................................................... 10/1000 μs, 40 ohms, 1.0 kV, 30 Tests, every 3 Min. ................(Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R final
How to Order
Typical Part Marking
Represents total content. Layout may vary.
PART
IDENTIFICATION:
10 = CMF-SD10
25 = CMF-SD25
35 = CMF-SD35
50 = CMF-SD50
35A = CMF-SD35A
50A = CMF-SD50A
25K = CMF-SD25-10
35K = CMF-SD35-10
50K = CMF-SD50-10
35AK = CMF-SD35A-10
50AK = CMF-SD50A-10
50AL = CMF-SD50A-15
MANUFACTURER'S
TRADEMARK
356G
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
YEAR CODE:
6 = 2006
CMF - SD 35 A -10 - 2
Product Designator
Style
SD = Surface Mount Dual Pkg.
Rated Resistance (RN)
10, 25, 35, 50 (25, 35, 50 Ohms)
Reduced Footprint and Height
Option*
Resistance Tolerance Option
Blank = Standard (20 %)
-10 = 10 %
Packaging Options
- 2 = Tape & Reel
*Reduced footprint and height option currently
unavailable for Model CMF-SD25.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Applications
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Access equipment
CMF-SD Series - Telecom CPTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
CMF-SD35A
CMF-SD50A
9.00
(.354) MAX.
7.15
(.281) MAX.
B
10.80
(.425) MAX.
8.50
(.355) MAX.
C
10.20
(.402) MAX.
8.10
(.319) MAX.
D
4.88 - 5.28
(.192 - .208)
3.25 - 3.65
(.128 - .144)
E
2.41 - 2.61
(.095 - .103)
2.41 - 2.61
(.095 - .103)
F
0.5
(.020) MAX.
0.5
(.020) MAX.
G
2.5
(.098)
2.5
(.098)
H
1.0
(.039)
1.0
(.039)
A
Dim.
A
B
H
G
F
B
1
2
A
3
G
F
4
C
D
E
E
DIMENSIONS:
MM
(INCHES)
COPLANARITY:
0.15
(.006)
D
C
(Reduced value available on request.)
Packaging Options - Tape and Reel:
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400
pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
H
1
2
3
4
Dim.
Solder Reflow Recommendations
A
300
Preheating
Soldering
Cooling
B
250
Temperature (°C)
C
200
D
150
E
100
50
F
0
G
160–220
10–20
120
H
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
10.0
(.394)
8.80
(.346)
3.20
(.126)
2.00
(.079)
2.60
(.102)
5.00
(.197)
7.60
(.299)
10.0
(.394)
CMF-SD35A
CMF-SD50A
8.00
(.315)
7.05
(.278)
2.75
(.108)
2.00
(.079)
2.51
(.099)
3.45
(.136)
5.95
(.234)
8.15
(.321)
Time (seconds)
Solder reflow
•
Recommended reflow methods: IR, vapor phase oven, hot air oven.
•
Devices are not designed to be wave soldered to the bottom side of the
board.
•
Gluing the devices is not recommended.
•
Recommended maximum paste thickness is 0.25 mm (.010 inch).
•
Devices can be cleaned using standard industry methods and solvents.
DIMENSIONS:
MM
(INCHES)
Note:
•
If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
Rework
•
A device should not be reworked.
CMF-SD SERIES, REV. O, 05/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SD Series Tape and Reel Specifications
CMF-SD10
CMF-SD25-2
CMF-SD35-2
CMF-SD50-2
24.0 +0.30/-0.10
(0.945 +0.012/-0.004)
4.00 ± 0.10
(0.157 ± 0.004)
16.0 ± 0.10
(0.630 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
10.2 ± 0.10
(0.402 ± 0.004)
9.0 ± 0.10
(0.354 ± 0.004)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
11.5 ± 0.10
(0.453 ± 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
0.50
(0.020)
0.1
(0.004)
11.0 ± 0.10
(0.433 ± 0.004)
Tape Dimensions per EIA 481-2
W
P0
P
P2
A0
B0
D
F
E
T max.
T1 max.
K0
CMF-SD25-2
CMF-SD35-2
CMF-SD50-2
D
P0
P2
E
CMF-SD35A-2
CMF-SD50A-2
24.0 ± 0.20
(0.945 ± 0.008)
4.00 ± 0.10
(0.157 ± 0.004)
12.0 ± 0.10
(0.472 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
7.30 ± 0.10
(0.287 ± 0.004)
8.30 ± 0.10
(0.327 ± 0.004)
1.5 ± 0.10
(0.059 ± 0.004)
11.5 ± 0.10
(0.453 ± 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
0.50 ± 0.005
(0.020 ± 0.002)
0.1
(0.004)
8.80 ± 0.10
(0.346 ± 0.004)
T
F
W
330 -2/+0
(12.99 -.079/+0)
DIA.
B0
P
A0
K0
5°
16.4 +2.0/-0
(.646 +.079/-0)
MAX.
22.4
(.882)
CMF-SD35A-2
CMF-SD50A-2
D
P2
P0
E
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
DIA.
(3.94 ± .059)
T
K0
F
W
330 -2/+0
(12.99 -.079/+0)
93°
DIA.
B0
3.45
(.136)
5.8
(.228)
A0
1.0
(.039)
P
0.5
(.020)
DIMENSIONS:
2.5
(.098)
MM
(INCHES)
16.4 +2.0/-0
(.646 +.079/-0)
MAX.
22.4
(.882)
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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