CMF-SDP

MATERIAL DECLARATION SHEET
Material #
CMF-SDP
Product Line
PTC resistors
Date
1/6/2009
Version
A/0
RoHS Compliant
Yes
No.
1
Construction
element
Substrate
Material
group
Ceramic
Material
weight [g]
Materials
CAS
if applicable
Barium oxide
1304-28-5
50
Titanium
dioxide
13463-67-7
25
Strontium oxide
1314-18-7
10
Lead oxide
1317-36-8
7
Calcium oxide
1305-78-8
5
0.729
Silver
Top electrode
Silver
7440-22-4
Bottom electrode
Silver
0.005
Tinned copper wire
Copper
0.0936
Silver
7440-22-4
78
Zinc
7740-66-6
20
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56.626%
100
0.466%
100
0.388%
100
7.271%
2
Copper
7440-50-8
95
Tin
7440-31-5
4
Other
100
2
Other
4
Subpart
mass of
total wt. (%)
98
0.006
Other
3
Sum [%]
3
Other
2
Average mass
[%]
1
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MATERIAL DECLARATION SHEET
PPS
5
6
PPS shell
Soldering
PPS
Tin
0.3787
0.0667
26125-40-6
Other
2
Tin
7440-31-5
8
Lead
7439-92-1
90
Other
Epoxy resin
7
Glue
Epoxy resin
Marking
38891-59-7
Total weight
Glass
29.416%
100
5.181%
100
0.652%
99
0.0084
Glass
100
2
Other
8
98
1
65997-18-4
100
100
1.2874
This document was updated on: January 6, 2009
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemptions – 7a High temp solder & 7c lead in electronic ceramic parts.
Headquarters Riverside CA
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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