MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant Halogen free compliant MF-FSMF020X Multifuse March.06, 2009 A Yes Yes 1 Breakdown of part (eg Lead, Ceramic body, coating, plating, additive) Carbon Black 2 Copper plating 3 Foil 4 PCB Foil 5 Polymer 6 Prepreg 7 Packing-Carrier Tape No. 8 Packing-Cover Tape 9 Soldering plating 10 Protection layer Material/substance name (eg.Sn alloy, Cu Copper) Material/ substance weight in grams (±0.1%) CAS No. / Int. Identifier Carbon 0.0000741 1333-86-4 Material /substance weight % 4.69% Copper 0.0002214 7440-50-8 14.03% Copper 0.0009424 7440-50-8 59.71% Nickel 0.0000496 7440-02-0 3.14% Copper 0.0001861 7440-50-8 11.79% Polyethylene Homopolymer 0.0000656 9002-88-4 4.16% Proprietary Additives 0.0000001 - 0.01% Epoxy 0.0000027 35948-25-5 0.17% Glass fiber 0.0000018 65997-17-3 0.11% Polystyrene N/A 9003-53-6 - - Polyethylene Homopolymer N/A 9002-88-4 - - Polyethylene terephthalate N/A 25038-59-9 - - Polyethylene Homopolymer N/A 9002-88-4 - - Nickel 0.0000334 7440-02-0 2.12% Gold 0.0000001 7440-57-5 0.01% Epoxy 0.0000009 - 0.06% 0.06% Total weight (grams) 0.0015781 Total 100% 100% Sum(%) 4.69% 14.03% 62.86% 11.79% 4.16% 0.28% 2.13%