mfsmdf2

T
PL
IA
N
M
Features
Applications
■ Very low profile
■ Power Over Ethernet (IEEE 802.3 af) port
protection
*R
oH
S
CO
■ Very fast tripping time
■ Automotive electronic control module
■ High voltage
protection
■ Telecom equipment low voltage
protection
■ RoHS compliant* and halogen free**
■ 2018 footprint
■ Agency recognition:
MF-SMDF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
V max.
Volts
Model
I max.
Amps
Itrip
Resistance
Amperes
at 23 °C
Hold
Trip
Ohms
at 23 °C
Rmin
R1max
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
MF-SMDF050
60
10
0.55
1.20
0.200
1.0
2.5
3.0
0.9
MF-SMDF100/33X (1)
33
40
1.10
2.20
0.06
0.40
8.0
0.5
1.4
MF-SMDF150
15
40
1.50
3.00
0.05
0.17
8.0
0.8
1.1
10
40
2.00
4.00
0.030
0.100
8.0
2.4
1.1
24
20
2.60
5.20
0.015
0.075
8.0
0.8
1.1
MF-SMDF200
(2)
MF-SMDF260/24X (1)
(1)
UL recognized, TÜV pending.
(2)
Agency approval pending.
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................. 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours.......................................................... ±5 % typical resistance change
Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ........................................ ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .............................................. ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 .............................................. No change (marking still legible)
Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ................. No change (Rmin < R < R1max)
Test Procedures And Requirements For Model MF-SMDF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ....................................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C .............................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C .................................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ................................................................. No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles .................................................... No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours ................................................................. No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ............................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Thermal Derating Chart - Ihold/Itrip (Amps)
Model
Ambient Operating Temperature
-40 °C
-20 °C
0 °C
23 °C
40 °C
50 °C
60 °C
70 °C
85 °C
MF-SMDF050
0.87 / 1.90
0.77 / 1.68
0.67 / 1.46
0.55 / 1.20
0.46 / 1.00
0.41 / 0.89
0.36 / 0.79
0.31 / 0.68
0.23 / 0.50
MF-SMDF100/33X
1.66 / 3.32
1.47 / 2.94
1.29 / 2.58
1.10 / 2.20
0.91 / 1.82
0.83 / 1.66
0.73 / 1.46
0.64 / 1.28
0.50 / 1.00
MF-SMDF150
2.38 / 4.76
2.10 / 4.20
1.82 / 3.64
1.50 / 3.00
1.27 / 2.54
1.13 / 2.26
0.99 / 1.98
0.85 / 1.70
0.64 / 1.28
MF-SMDF200
2.95 / 5.90
2.65 / 5.30
2.35 / 4.70
2.00 / 4.00
1.74 / 3.48
1.59 / 3.18
1.44 / 2.88
1.29 / 2.58
1.06 / 2.12
MF-SMDF260/24X
3.75 / 7.50
3.35 / 6.70
3.00 / 6.00
2.60 / 5.20
2.35 / 4.70
2.15 / 4.30
2.05 / 4.10
1.80 / 3.60
1.50 / 3.00
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less..
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Product Dimensions
A
Model
MF-SMDF050
MF-SMDF100/33X
MF-SMDF150
MF-SMDF200
MF-SMDF260/24X
Min.
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
B
Max.
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
Min.
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
C
Max.
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
Min.
0.79
(0.031)
0.70
(0.028)
0.55
(0.022)
0.55
(0.022)
0.70
(0.028)
Max.
1.09
(0.043)
1.25
(0.049)
0.85
(0.033)
0.85
(0.033)
2.00
(0.079)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
E
Style
Min.
Max.
N/A
N/A
1
0.25
(0.010)
0.70
(0.028)
2
N/A
N/A
1
N/A
N/A
1
0.25
(0.010)
0.70
(0.028)
3
Packaging: 6000 pcs. per reel; 4000 pcs. per reel for Model MF-SMDF260/24X.
DIMENSIONS:
MM
(INCHES)
Style 1
Top and Bottom View
505Y
A
Side View
Recommended Pad Layout
C
1.5 ± 0.05
(.059 ± .002)
Terminal material:
Electroless Ni under immersion Au
1.5 ± 0.05
(.059 ± .002)
4.6 ± 0.1
(.181 ± .004)
B
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
3.4 ± 0.1
(.134 ± .004)
D
Typical Part Marking
Represents total content. Layout may vary.
Style 2
Top View
Bottom View
BI-WEEKLY DATE CODE:
(Y = WEEKS 49-50)
Side View
A
C
YEAR CODE:
(5 = 2005)
505Y
6
B
PART
IDENTIFICATION:
50 = MF-SMDF050
15 = MF-SMDF150
20 = MF-SMDF200
X
D
E
PART IDENTIFICATION:
6 = MF-SMDF100/33X
6
Style 3
Top View
Bottom View
A
Side View
X
C
D
BI-WEEKLY DATE CODE:
(X = WEEKS 47-48)
PART IDENTIFICATION:
D = MF-SMDF260/24X
B
D
L
D
E
L
BI-WEEKLY DATE CODE:
(L = WEEKS 23-24)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
How to Order
Soldering
MF - SMDF 100 /33X - 2
Cooling
Product
Designator
Temperature (°C)
250
Series
SMDF = 2018 Surface Mount
Component
200
Hold Current, Ihold
050 = 0.50 A
100 = 1.10 A
150 = 1.50 A
200 = 2.00 A
260 = 2.60 A
150
100
50
Higher Voltage Option
__ = Standard Voltage
/24X = 24 V Rated
/33X = 33 V Rated
X = Multifuse® freeXpansion Design™
MF-SMDF Series
0
10–20
160–220
120
Time (seconds)
Notes:
•
MF-SMDF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations.
•
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
•
Compatible with Pb and Pb-free solder reflow profiles.
•
Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse®
Polymer PTC Soldering Recommendation guidelines.
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
MF-SMDF100/33X
Time to Trip (Seconds)
10
MF-SMDF050
MF-SMDF260/24X
1
0.1
0.01
MF-SMDF200
MF-SMDF150
0.001
0.1
1
10
100
Fault Current (Amps)
MF-SMDF SERIES, REV. T, 08/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-SMDF Series Tape and Reel Specifications
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
MF-SMDF050, 150, 200
per EIA 481-2
16.0 ± 0.3
(0.630 ± 0.012)
4.0 ± 0.1
(0.157 ± 0.004)
8.0 ± 0.1
(0.315 ± 0.004)
2.0 ± 0.1
(0.079 ± 0.004)
5.1 ± 0.15
(0.201 ± 0.006)
5.6 ± 0.23
(0.220 ± 0.009)
12.1
(0.476)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.10
(0.295 + 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
1.0 ± 0.15
(0.039 ± 0.006)
390
(15.35)
160
(6.30)
MF-SMDF100/33X
per EIA 481-2
16.0 ± 0.3
(0.630 ± 0.012)
4.0 ± 0.1
(0.157 ± 0.004)
8.0 ± 0.1
(0.315 ± 0.004)
2.0 ± 0.1
(0.079 ± 0.004)
5.1 ± 0.1
(0.201 ± 0.004)
5.6 ± 0.1
(0.221 ± 0.004)
12.1
(0.476)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.10
(0.295 + 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
1.1 ± 0.1
(0.043 ± 0.004)
390
(15.35)
160
(6.30)
MF-SMDF260/24X
per EIA 481-2
16.0 ± 0.3
(0.630 ± 0.012)
4.0 ± 0.1
(0.157 ± 0.004)
8.0 ± 0.1
(0.315 ± 0.004)
2.0 ± 0.1
(0.079 ± 0.004)
5.4 ± 0.15
(0.213 ± 0.006)
5.7 ± 0.15
(0.234 ± 0.006)
12.1
(0.476)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.10
(0.295 + 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
2.15 ± 0.15
(0.085 ± 0.006)
390
(15.35)
160
(6.30)
331
(13.03)
50
(1.97)
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0)
22.4
(0.882)
331
(13.03)
50
(1.97)
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0)
22.4
(0.882)
331
(13.03)
50
(1.97)
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0)
22.4
(0.882)
Reel Dimensions
A max.
N min.
W1
W2 max.
DIMENSIONS:
MM
(INCHES)
P0
T
D0
P2
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
W1(MEASURED
AT HUB)