PL IA N T SinglFuse™ SF-0603F Series Features LE AD F RE E *R oH S C OM n Single blow fuse for overcurrent protection n 1608 (EIA 0603) miniature footprint n Fast-acting fuse n UL listed n RoHS compliant* and halogen free** n Thin film chip fuse n Surface mount packaging for automated assembly SF-0603F Series - Fast Acting Surface Mount Fuses Model Rated Current (Amps) SF-0603F050 0.50 SF-0603F063 SF-0603F080 SF-0603F100 SF-0603F125 SF-0603F150 SF-0603F160 SF-0603F200 SF-0603F250 SF-0603F300 SF-0603F315 SF-0603F400 0.63 0.80 1.00 1.25 1.50 1.60 2.00 2.50 3.00 3.15 4.00 SF-0603F500 Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Characteristics Fusing Time Resistance (mΩ) Typ.*** Rated Voltage Breaking Capacity 250 DC 50 V DC 50 V 50 A Open within 1 min. at 200 % rated current 5.00 173 115 88 63 45 42 33 24 21 19 15 12 DC 32 V DC 32 V 50 A DC 24 V DC 24 V 50 A DC 32 V DC 32 V 50 A Typical I2t (A2s) 0.005 0.007 0.014 0.016 0.027 0.037 0.041 0.044 0.055 0.082 0.089 0.239 0.433 ***Resistance value was measured with less than 10 % of rated current. Reliability Testing Parameter Requirement Test Method Carrying Capacity...................................... No fusing.....................................................Rated current, 4 hours Fusing Time............................................... Within 1 minute...........................................200 % of its rated current Interrupting Ability...................................... No mechanical damages............................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test.............................................. No mechanical damages............................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat......................... ±20 %..........................................................260 °C ±5 °C,10 seconds ±1 second Solderability............................................... 95 % coverage minimum............................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise...................................... <75 °...........................................................100 % of its rated current, measure of surface temperature Resistance to Dry Heat............................. ±20 %..........................................................105 °C ±5 °C,1000 hours Resistance to Solvent................................ No evident damage on protective...............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating and marking Residual Resistance.................................. 10k W or more............................................Measure DC resistance after fusing Thermal Shock.......................................... DR < 10 %..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles Typical Part Marking Represents total content. Layout may vary. How to Order SF - 0603 F 050 - 2 SinglFuse™ Product Designator SMD Footprint 1608 (EIA 0603) size RATING CURRENT (A) S = 2.00 F = 0.50 T = 2.50 I = 0.63 3 = 3.00 K = 0.80 U = 3.15 L = 1.00 W = 4.00 M = 1.25 Y = 5.00 P = 1.50 N = 1.60 6 = 6.00 Fuse Blow Type F = Fast acting S = Slow blow Rated Current 050-500 (500 mA - 5.00 A) Packaging Type - 2 = Tape & Reel (5,000 pcs./reel) Asia-Pacific: Tel: +886-2 2562-4117 Email: [email protected] Europe: Tel: +36 88 520 390 Email: [email protected] The Americas: Tel: +1-951 781-5500 Email: [email protected] www.bourns.com * RoHS Directive 2002/95/EC Jan 27 2003 including Annex. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. SinglFuse™ SF-0603F Series Applications n Portable memory n Cell phones n LCD monitors n Rechargeable battery packs n Disk drives n Battery chargers n PDAs n Set top boxes n Digital cameras n Industrial controllers 250 n DVDs Peak: 250 +0/-5 °C 230 °C or higher SF-0603F Series - Fast Acting Surface Mount 200 Fuses TEMPERATURE (°C) Solder Reflow Recommendations 150 180 °C PRE-HEATING ZONE 150 °C 90 ± 30 Seconds 100 250 30 ± 10 Seconds Peak: 250 +0/-5 °C SOLDERING ZONE 230 °C or higher TEMPERATURE (°C) 50 200 150 HEATING TIME PRE-HEATING ZONE 180 °C PEAK: 250 +0/-5 °C, 5 seconds PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds 150 °C 90 ± 30 Seconds 1.6 ± 0.1 (.063 ± .004) 100 1.02 (.040) 30 ± 10 Seconds SOLDERING ZONE 50 PEAK: 250 +0/-5 °C, 5 seconds Product Dimensions PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING 1.6 ±ZONE: 0.1 230 °C or higher, 30 ± 10 seconds 0.3 ± 0.2 1.6 ± 0.1 (.012 ± .008) (.063 ± .004) (.063 ± .004) 1.09 (.043) 0.8 ± 0.1 (.031 ± .004) HEATING TIME 0.3 ± 0.2 (.012 ± .008)1.02 (.040) Recommended Pad Layout 1.02 (.040) 0.45 ± 0.1 (.018 ± .004) 0.8 ± 0.1 (.031 ± .004) 0.8 ± 0.1 (.031 ± .004) 0.35 ± 0.2 (.014 ± .008) 0.35 ± 0.2 (.014 ± .008) 0.3 ± 0.2 (.012 ± .008) 0.3 ± 0.2 (.012 ± .008) 0.3 ± 0.2 (.012 ± .008) 0.45 ± 0.1 PACKAGING: 5,000 pcs./reel 0.3 ± 0.2 (.012 ± .008) DIMENSIONS: 1.09 (.043) 2.54 (.010) MM (INCHES) 0.45 ± 0.1 (.018 ± .004) (.018 ± .004) 0.35 ± 0.2 1.09 (.043) 2.54 (.010) 2.54 (.010) 0.35 ± 0.2 Thermal Curve (.014Derating ± .008) (.014 ± .008) 0.35 ± 0.2 (.014 ± .008) Construction & Material Content 0.35 ± 0.2 (.014 ± .008) PERCENT OF RATING (%) 120 OVERCOAT 110 Sn PLATING 100 FUSE ELEMENT 90 Cu / Ni PLATING CERAMIC SUBSTRATE 80 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Operating Temperature...................................................................................-40 °C to +105 °C Storage Conditions Temperature.................................................................................................+5 °C to +35 °C Humidity...........................................................................................................40 % to 75 % Shelf Life........................................................................... 2 years from manufacturing date Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. SF-0603F Series - Fast Acting Surface Mount Fuses Average Time Current 1.50 A Curves 1.25 A 1.00 A1.50 A 0.80 A 1.25 A 0.63 A 1.00 A 0.50 A 0.80 A 0.63 A 0.50 A 100 100 Minimum I2T V Clear Time Curves 1.60 A 2.00 A 2.50 1.60AA 3.00 AA 2.00 3.152.50 A A 3.00A A 4.00 3.15A A 5.00 4.00 A 5.00 A 5.00 A 100 4.00 A 5.00 A 3.15 A 3.004.00 A A 2.50 3.15 A A 2.003.00 A A 1.602.50 A A 1.502.00 A A 1.25 1.60 A A 1.50 A 1.00 A 1.25 A 100 10 10 10 MIN. I2T (A2 SEC) MIN. I2T (A2 SEC) CLEARING TIME (S) CLEARING TIME (S) 10 0.801.00 A A 0.63 A 0.80 A 0.50 A 0.63 A 1 1 1 0.1 0.1 0.50 A 1 0.1 0.1 0.01 0.01 0.01 0.001 0.01 0.001 0.0001 0.1 0.0001 0.1 1 10 CURRENT (A) 1 CURRENT (A) 100 10 100 0.001 0.001 0.001 0.001 0.01 0.1 CLEARING TIME (S)0.1 0.01 CLEARING TIME (S) REV. E 05/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1 1 SF-0603F Series Tape and Reel Specifications Tape Dimensions SF-0603F Series per EIA 481-2 8.0 ± 0.2 (.315 ± .008) W P 0 P1 P 2 4.0 ± 0.1 (.157 ± .004) 4.0 ± 0.1 (.157 ± .004) 2.0 ± 0.05 (.079 ± .002) 1.1 ± 0.1 (.043 ± .004) A 1.9 ± 0.1 (.075 ± .004) B 3.5 ± 0.05 (.138 ± .002) F 1.75 ± 0.1 (.069 ± .004) E 1.5 + 0.1/-0 (.059 + .004/-0) D0 0.64 ± 0.1 (.025 ± .004) T Reel Dimensions 180 +0/-3.0 (7.087 +0/-.118) A B Min. C 60.0 (2.362) 13.0 ± 1.0 (.512 ± .039) 9.0 ± 1.0 (.354 ± .039) W 11.4 ± 2.0 (.449 ± .079) T T DIMENSIONS: MM (INCHES) W BOTTOM TAPE A DIA. C DIA. DO PO E TOP TAPE B B DIA. PAPER TAPE RESISTOR TAPE T F A P1 P2 DIRECTION OF UNREELING Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W