PL IA N T SinglFuse™ SF-1206S Series Features ■ Surface mount packaging for automated *R oH S CO M ■ Single blow fuse for overcurrent ■ ■ ■ ■ ■ protection 3216 (EIA 1206) miniature footprint Slow blow fuse UL listed RoHS compliant* and halogen free** Thin film chip fuse assembly SF-1206S Series - Slow Blow Surface Mount Fuses Electrical Characteristics SF-1206S050 SF-1206S080 SF-1206S100 SF-1206S125 SF-1206S150 Rated Current (Amps) 0.50 0.80 1.00 1.25 1.50 SF-1206S200 2.00 SF-1206S250 SF-1206S300 SF-1206S400 SF-1206S500 2.50 3.00 4.00 5.00 SF-1206S700 7.00 Model Fusing Time Open within 5 sec. at 250 % rated current Resistance (mΩ) Typ.*** 385 165 108 76 51 Rated Voltage Breaking Capacity DC 63 V DC 63 V 50 A DC 32 V DC 32 V 50 A DC 24 V DC 24 V 50 A 32 26 20 14 10 Typical I2t (A2s) 0.030 0.068 0.098 0.155 0.236 0.339 6.5 0.605 0.933 1.537 2.533 5.684 ***Resistance value was measured with less than 10 % of rated current. Reliability Testing Parameter Requirement Test Method Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours Fusing Time .............................................. Within 5 seconds........................................250 % of its rated current Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface temperature Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating and marking Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles Typical Part Marking How to Order Represents total content. Layout may vary. SF - 1206 S 050 - 2 SinglFuse™ Product Designator SMD Footprint 3216 (EIA 1206) size RATING CURRENT (A) F = 0.50 T = 2.50 K = 0.80 3 = 3.00 L = 1.00 W = 4.00 M = 1.25 Y = 5.00 P = 1.50 Z = 7.00 S = 2.00 Fuse Blow Type F = Fast acting S = Slow blow Rated Current 050-700 (500 mA - 7.00 A) Packaging Type - 2 = Tape & Reel (5,000 pcs./reel) Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com * RoHS Directive 2002/95/EC Jan 27 2003 including Annex. ** Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. SinglFuse™ SF-1206S Series Applications ■ Portable memory ■ Cell phones ■ LCD monitors ■ Rechargeable battery packs ■ Disk drives ■ Battery chargers ■ PDAs ■ Set top boxes ■ Digital cameras ■ Industrial controllers ■ DVDs SF-1206S Series - Slow Blow Surface Mount Fuses Solder Reflow Recommendations 250 Peak: 250 +0/-5 °C TEMPERATURE (°C) 230 °C or higher 200 PRE-HEATING ZONE 180 °C PEAK: 250 +0/-5 °C, 5 seconds PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds 150 °C 150 90 ± 30 Seconds 100 30 ± 10 Seconds SOLDERING ZONE 50 HEATING TIME Product Dimensions Recommended Pad Layout 3.1 ± 0.1 (.122 ± .004) 1.27 (.050) 0.6 ± 0.1 (.024 ± .004) 1.55 ± 0.1 (.061 ± .004) 2.03 (.080) 0.5 ± 0.2 (.020 ± .008) 0.5 ± 0.3 (.020 ± .012) 0.5 ± 0.2 (.020 ± .008) 0.5 ± 0.3 (.020 ± .012) DIMENSIONS: PACKAGING: 5,000 pcs./reel 3.81 (.150) MM (INCHES) Thermal Derating Curve Construction & Material Content PERCENT OF RATING (%) 120 OVERCOAT 110 Sn PLATING 100 FUSE ELEMENT Cu / Ni PLATING 90 CERAMIC SUBSTRATE 80 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Operating Temperature..................................................................................-40 °C to +105 °C Storage Conditions Temperature ................................................................................................+5 °C to +35 °C Humidity...........................................................................................................40 % to 75 % Shelf Life........................................................................... 2 years from manufacturing date Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. SF-1206S Series - Slow Blow Surface Mount Fuses Minimum I2T V Clear Time Curves Average Time Current Curves 1.50 A 1.25 A 1.00 A 0.80 A 0.50 A 2.00 A 2.50 A 3.00 A 4.00 A 5.00 A 7.00 A 100 100 7.00 A 5.00 A 4.00 A 10 3.00 A 2.50 A 10 MIN. I2T (A2 SEC) CLEARING TIME (S) 2.00 A 1 1.50 A 1.25 A 1.00 A 1 0.80 A 0.50 A 0.1 0.1 0.01 0.01 0.001 0.1 1 10 CURRENT (A) 100 0.001 0.001 0.01 0.1 CLEARING TIME (S) REV. D 03/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1 SF-1206S Series Tape and Reel Specifications SF-1206S Series per EIA 481-2 Tape Dimensions W 8.0 ± 0.2 (.315 ± .008) P0 4.0 ± 0.1 (.157 ± .004) P1 4.0 ± 0.1 (.157 ± .004) P2 2.0 ± 0.05 (.079 ± .002) A 2.0 ± 0.15 (.079 ± .006) B 3.6 ± 0.2 (.142 ± .008) F 3.5 ± 0.05 (.138 ± .002) E 1.75 ± 0.1 (.069 ± .004) 1.5 + 0.1/-0 (.059 + .004/-0) D0 0.84 ± 0.1 (.033 ± .004) T Reel Dimensions 180 +0/-3.0 (7.087 +0/-.118) A 60.0 (2.362) B Min. C 13.0 ± 1.0 (.512 ± .039) W 9.0 ± 1.0 (.354 ± .039) T 11.4 ± 2.0 (.449 ± .079) T DIMENSIONS: MM (INCHES) W BOTTOM TAPE A DIA. C DIA. DO PO E TOP TAPE B B DIA. F PAPER TAPE RESISTOR TAPE T A P1 W P2 DIRECTION OF UNREELING Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.