cd2320 b

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ RoHS compliant*
■ AC operated products
■ Low power loss and high efficiency
■ Computer monitors
■ High current capability
■ Set top boxes
■ Low profile package
■ Cable modems
CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components.
Bourns offers Bridge Rectifier Diodes for rectification applications in compact chip package 2320 size format, which offers PCB real
estate savings and are considerably smaller than most competitive parts. The Bridge Rectifier Diodes offer a forward current of 1 A
with a choice of repetitive peak reverse voltages between 200 V and 1000 V.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Maximum Repetitive
Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current (TA = 55 °C)
DC Reverse Current @ Rated DC
Blocking Voltage (TJ = 25 °C)
DC Reverse Current @ Rated DC
Blocking Voltage (TJ = 150 °C)
Typical Junction Capacitance 1
Maximum Instantaneous Forward Voltage
@1A
Typical Thermal Resistance 1
Peak Forward Surge Current 8.3 ms
Single Half Sine-Wave Superimposed
on Rated Load (JEDEC Method)
B1200
B1400
CD2320B1600
B1800
B11000
VRRM
200
400
600
800
1000
V
VRMS
VDC
140
200
280
400
420
600
560
800
700
1000
V
V
Symbol
Unit
I(AV)
1.0
A
IR
5
μA
IR
200
μA
CJ
25
pF
VF
1
V
RƟJL
110
°C/W
IFSM
30
A
Notes:
1 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC.
2 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Temperature Range
Storage Temperature Range
Symbol
TJ
TSTG
CD2320-B1200-B11000
-55 to +175
-55 to +175
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Unit
°C
°C
CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode
Product Dimensions
This is a lead free product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated (lead free) and are
solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.07 g. The package and dimensions are shown below.
A
Dimensions
B
F
TOP VIEW
C
MM
DIMENSIONS:
(INCHES)
D
A
5.20 - 5.40
(0.205 - 0.213)
B
4.10 - 4.30
(0.161 - 0.169)
C
5.70 - 5.90
(0.224 - 0.232)
D
1.00 - 1.20
(0.039 - 0.047)
E
0.85 - 0.95
(0.033 - 0.037)
F
0.86 - 1.16
(0.0338 - 0.0457)
E
Recommended Footprint
How to Order
CD 2320 - B 1 800
4.10 ± 0.1
(0.161 ± 0.004)
Common Code
Chip Diode
Package
2320 = 23 ˝ x 20 ˝
Model
B = Schottky Rectifier Series
Current
1=1A
5.72 ± 0.1
(0.225 ± 0.004)
Working Peak Reverse Voltage
800 = 800 VRWM (Volts)
Typical Part Marking
MANUFACTURER'S
TRADEMARK
1.10 ± 0.1
(0.043 ± 0.004)
1.5 ± 0.1
(0.059 ± 0.004)
FORWARD
CURRENT
x 100 mA
VRMS = 800 V
MM
DIMENSIONS:
(INCHES)
DATE CODE
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode
Rating and Characteristic Curves
Maximum Non-Repetitive Peak Forward Surge Current
1.2
Peak Forward Surge Current (Amps)
Average Forward Rectified Current (Amps)
Forward Current Derating Curve
1.0
0.8
0.6
0.4
0.2
60 Hz Resistive
or Inductive Load
0
0
25
50
75
100
125
40
35
30
25
20
15
10
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
5
0
150 175
10
1
Ambient Temperature (°C)
Forward Characteristics
Reverse Characteristics
100
Instantaneous Reverse Current (mA)
10.00
Instantaneous Forward Current (Amps)
100
Number of Cycles at 60 Hz
1.00
0.10
TJ = 100 °C
10.0
1.0
TJ = 25 °C
0.10
TJ = 25 °C
Pulse Width = 300 µS
0.01
0.2
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
20
40
60
80
Typical Junction Capacitance
Junction Capacitance (pF)
100
TJ = 25 °C
10
1
0.1
0.2
0.4
1.0
2
4
10
Reverse Voltage (Volts)
20
100
120
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Voltage (Volts)
40
100
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
140
CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode
Packaging Information
The surface mount product is packaged in a 12 mm x 8 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
MM
(INCHES)
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
2320
Carrier Width
A
5.90 ± 0.10
(0.232 ± 0.004)
Carrier Length
B
6.50 ± 0.10
(0.256 ± 0.004)
Carrier Depth
C
1.50 ± 0.10
(0.059 ± 0.004)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
330
(12.992)
Reel Inner Diameter
D1
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
5.50 ± 0.05
(0.217 ± 0.002)
Punch Hole Pitch
P
8.00 ± 0.10
(0.315 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
12.00 ± 0.20
(0.472 ± 0.008)
Reel Width
W1
Quantity per Reel
--
50.0
MIN.
(1.969)
18.7
MAX.
(0.736)
5,000
REV. 08/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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