cddfn2 T 33b

T
PL
IA
N
OM
C
Applications
n Bidirectional TVS 3.3 V
n Computers and peripherals
n Low capacitance - 13 pF
n Communication systems
n ESD protection 15 kV
n Audio & video equipment
n 0402 DFN package
n Portable instrumentation
n RoHS compliant*
n Handheld portable devices
LE
AD
F
RE
E
*R
oH
S
Features
CDDFN2-T3.3B - Surface Mount TVS Diode
General Information
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR IA E
NT
*
The Bourns® Model CDDFN2-T3.3B low capacitance device provides ESD, EFT and surge protection
for external ports of electronic devices such as cellular phones, handheld electronics and other
portable electronic devices.
The device measures 1.0 mm x 0.60 mm x 0.55 mm and is available in a DFN-2 package intended to
be mounted directly onto an FR4 printed circuit board. The device will fit a 0402 footprint.
The device is designed to meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC61000-4-5 (Surge)
protection requirements.
Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Value
TSTG
-55 to +150
ºC
TOPR
-55 to +85
°C
ESD
ESD
15
15
kV
kV
EFT Protection per IEC 61000-4-4
(5/50 ns)
EFT
50
A
Peak Pulse Current per IEC 61000-4-5
(8/20 µs)
Ipp
5
A
Storage Temperature
Operating Temperature
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
Unit
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Working Peak Voltage
Breakdown Voltage @ 1 mA
Symbol
Min.
VWM
-3.3
3.3
V
4
6.5
V
0.1
1.0
μA
13.5
16.5
pF
6.5
8
V
VBR
Leakage Current @ 3.3 V
IL
Capacitance @ 0 V, 1 MHz
Clamping Voltage @ IPP = 5 A, 8/20 μs
CJ
VC
Typ.
Max.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Unit
D
BOTTOM
VIEW
E
F
45 °
0.125
(0.005)
0.05
(0.002)
CDDFN2-T3.3B - Surface Mount TVS Diode
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Recommended PCB Footprint
This is a molded DFN-2 package weighing approximately 0.9 mg.
0.30
(0.012)
TOP VIEW
A
0.60
(0.024)
0.55
(0.022)
B
Typical Part Marking
SIDE VIEW
CDDFN2-T3.3B............................................................................... Y
C
How to Order
CD DFN2 - T 3.3 B
Common Diode
Chip Diode
D
BOTTOM
VIEW
Package
DFN2 = DFN-2 Package
E
Model
Transient Voltage Suppressor
F
45 °
Suffix
B = Bidirectional Diode
0.125
(0.005)
0.05
(0.002)
Symbol
A
B
C
D
E
F
0.60
(0.024)
Working Peak Reverse Voltage
3.3 = 3.3 VRWM (Volts)
Block Diagram
Min.
0.95
(0.037)
0.55
(0.022)
0.41
(0.016)
0.20
(0.008)
0.45
0.55
(0.018)
(0.022)
DIMENSIONS:
MM
(INCHES)
Dimensions
Nom.
1.00
(0.039)
0.60
(0.024)
0.30
0.45
(0.012)
(0.018)
0.65
(0.026)
0.25
(0.010)
0.50
(0.020)
DIMENSIONS:
Max.
1.05
(0.041)
0.65
(0.026)
0.50
(0.020)
0.30
(0.012)
0.55
(0.022)
MM
(INCHES)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDDFN2-T3.3B - Surface Mount TVS Diode
Performance Graphs
TLP I-V Plot
120
Test Waveform Parameters
tr = 8 µs
td = 20 µs
tt
100
80
Device Current (A)
IPP – Peak Pulse Current (% of IPP)
Pulse Waveform
60
40
td = t|IPP/2
20
0
0
5
10
15
20
25
30
t – Time (µs)
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
TLP
100 ns
IDUT
+
VDUT
DUT
-
Pin 1 to Pin 2
-8 -7 -6 -5 -4 -3 -2 -1 -0 1
2
Device Voltage (V)
Typical Capacitance Variation of CIN vs VIN
16
14
Input Capacitance (pF)
12
Pin 1 to Pin 2
10
8
6
4
f = 1 MHz,
T = 25 °C
2
0
-4
-3
-2
-1
0
1
2
3
4
Input Voltage (V)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3
4
5 6
7
8
CDDFN2-T3.3B - Surface Mount TVS Diode
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
IndexHole
120°
B
F
D2
W
D1 D
d
1
P
A
Trailer
.......
.......
End
C
Device
.......
.......
10pitches(min.)
.......
.......
Leader
.......
.......
10pitches(min.)
W1
Start
DIMENSIONS:
MM
(INCHES)
DirectionofFeed
Item
Symbol
DFN-2
Carrier Width
A
0.70 ± 0.05
(0.028 ± 0.002)
Carrier Length
B
1.15 ± 0.05
(0.045 ± 0.002)
Carrier Depth
C
0.47 ± 0.05
(0.019 ± 0.002)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
179.0 ± 1.00
(7.05 ± 0.04)
Punch Hole
d1
0.4± 0.05
0.016 ± 0.002
Reel Inner Diameter
D1
60.0 ± 0.50
2.362 ± 0.02
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
2.00 ± 0.05
(0.079 ± 0.002)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.05
(0.008 ± 0.002)
Tape Width
W
8.00 ± 0.10
(0.315 ± 0.004)
Reel Width
W1
Quantity per Reel
--
14.4
MAX.
(0.567)
12,000
REV. 02/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can
and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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