T PL IA N OM C Applications n Bidirectional TVS 3.3 V n Computers and peripherals n Low capacitance - 13 pF n Communication systems n ESD protection 15 kV n Audio & video equipment n 0402 DFN package n Portable instrumentation n RoHS compliant* n Handheld portable devices LE AD F RE E *R oH S Features CDDFN2-T3.3B - Surface Mount TVS Diode General Information Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * The Bourns® Model CDDFN2-T3.3B low capacitance device provides ESD, EFT and surge protection for external ports of electronic devices such as cellular phones, handheld electronics and other portable electronic devices. The device measures 1.0 mm x 0.60 mm x 0.55 mm and is available in a DFN-2 package intended to be mounted directly onto an FR4 printed circuit board. The device will fit a 0402 footprint. The device is designed to meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC61000-4-5 (Surge) protection requirements. Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Value TSTG -55 to +150 ºC TOPR -55 to +85 °C ESD ESD 15 15 kV kV EFT Protection per IEC 61000-4-4 (5/50 ns) EFT 50 A Peak Pulse Current per IEC 61000-4-5 (8/20 µs) Ipp 5 A Storage Temperature Operating Temperature ESD Protection per IEC 61000-4-2 Contact Discharge Air Discharge Unit Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Working Peak Voltage Breakdown Voltage @ 1 mA Symbol Min. VWM -3.3 3.3 V 4 6.5 V 0.1 1.0 μA 13.5 16.5 pF 6.5 8 V VBR Leakage Current @ 3.3 V IL Capacitance @ 0 V, 1 MHz Clamping Voltage @ IPP = 5 A, 8/20 μs CJ VC Typ. Max. Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Unit D BOTTOM VIEW E F 45 ° 0.125 (0.005) 0.05 (0.002) CDDFN2-T3.3B - Surface Mount TVS Diode Product Dimensions DIMENSIONS: MM (INCHES) Recommended PCB Footprint This is a molded DFN-2 package weighing approximately 0.9 mg. 0.30 (0.012) TOP VIEW A 0.60 (0.024) 0.55 (0.022) B Typical Part Marking SIDE VIEW CDDFN2-T3.3B............................................................................... Y C How to Order CD DFN2 - T 3.3 B Common Diode Chip Diode D BOTTOM VIEW Package DFN2 = DFN-2 Package E Model Transient Voltage Suppressor F 45 ° Suffix B = Bidirectional Diode 0.125 (0.005) 0.05 (0.002) Symbol A B C D E F 0.60 (0.024) Working Peak Reverse Voltage 3.3 = 3.3 VRWM (Volts) Block Diagram Min. 0.95 (0.037) 0.55 (0.022) 0.41 (0.016) 0.20 (0.008) 0.45 0.55 (0.018) (0.022) DIMENSIONS: MM (INCHES) Dimensions Nom. 1.00 (0.039) 0.60 (0.024) 0.30 0.45 (0.012) (0.018) 0.65 (0.026) 0.25 (0.010) 0.50 (0.020) DIMENSIONS: Max. 1.05 (0.041) 0.65 (0.026) 0.50 (0.020) 0.30 (0.012) 0.55 (0.022) MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDDFN2-T3.3B - Surface Mount TVS Diode Performance Graphs TLP I-V Plot 120 Test Waveform Parameters tr = 8 µs td = 20 µs tt 100 80 Device Current (A) IPP – Peak Pulse Current (% of IPP) Pulse Waveform 60 40 td = t|IPP/2 20 0 0 5 10 15 20 25 30 t – Time (µs) 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 TLP 100 ns IDUT + VDUT DUT - Pin 1 to Pin 2 -8 -7 -6 -5 -4 -3 -2 -1 -0 1 2 Device Voltage (V) Typical Capacitance Variation of CIN vs VIN 16 14 Input Capacitance (pF) 12 Pin 1 to Pin 2 10 8 6 4 f = 1 MHz, T = 25 °C 2 0 -4 -3 -2 -1 0 1 2 3 4 Input Voltage (V) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 3 4 5 6 7 8 CDDFN2-T3.3B - Surface Mount TVS Diode Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E IndexHole 120° B F D2 W D1 D d 1 P A Trailer ....... ....... End C Device ....... ....... 10pitches(min.) ....... ....... Leader ....... ....... 10pitches(min.) W1 Start DIMENSIONS: MM (INCHES) DirectionofFeed Item Symbol DFN-2 Carrier Width A 0.70 ± 0.05 (0.028 ± 0.002) Carrier Length B 1.15 ± 0.05 (0.045 ± 0.002) Carrier Depth C 0.47 ± 0.05 (0.019 ± 0.002) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 179.0 ± 1.00 (7.05 ± 0.04) Punch Hole d1 0.4± 0.05 0.016 ± 0.002 Reel Inner Diameter D1 60.0 ± 0.50 2.362 ± 0.02 Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 2.00 ± 0.05 (0.079 ± 0.002) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.05 (0.008 ± 0.002) Tape Width W 8.00 ± 0.10 (0.315 ± 0.004) Reel Width W1 Quantity per Reel -- 14.4 MAX. (0.567) 12,000 REV. 02/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.