CO LO & MP LI GE AN N T FR EE *R oH S ** HA Features Applications ■ Protects one line or one I/O port ■ VDSL lines ■ Bidirectional configuration ■ Modems ■ ESD protection 30 kV max. ■ Routers ■ Low capacitance ~ 3 pF typ. ■ Replaces 0805 MLV devices ■ RoHS compliant* ■ Halogen free** CDSOD323-TxxC-DSL - TVS Diode Series General Information The markets of portable communications and telecom equipment are challenging the semiconductor industry to develop increasingly smaller electronic components for highspeed communication rates. BIDIRECTIONAL 1 Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection applications in SOD323 package size format. The Transient Voltage Suppressor Diode series offers a choice of voltage types ranging from 12 V to 24 V in a bidirectional configuration. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and will assist in meeting IEC 61000-4-5 (Surge) requirements. 2 Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) CDSOD323Parameter Symbol T12C-DSL T24C-DSL Unit Peak Pulse Current (tp = 8/20 µs) IPPM 11 6 A Peak Pulse Power (tp = 8/20 µs) PPP 350 W TJ -55 to +150 ºC TSTG -55 to +150 ºC ESD ESD ±8 ±30 kV kV ESD ESD ±15 ±30 kV kV Operating Temperature Storage Temperature ESD Protection (per IEC 61000-4-2) Contact Discharge Minimum Maximum Air Discharge Minimum Maximum Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) CDSOD323Parameter Symbol T12C-DSL T24C-DSL Unit Min. Breakdown Voltage @ 1 mA VBR 13.3 26.7 V Working Peak Voltage Vwm 12.0 24.0 V Maximum Clamping Voltage @ IP = 1 A VC 19.0 43.0 V Typical Clamping Voltage @ 8/20 µs @ IPP VC 28.3 V @ 11 A 56.0 V @ 6 A V Maximum Leakage Current @ VWM ID 1 nA Typical Capacitance @ 0 V, 1 MHz CJ 3 pF Note: The electrical specifications apply in both polarities. * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. ** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br ) content is 900 ppm or less; (b) the Chlorine ( Cl ) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine ( Cl ) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOD323-TxxC-DSL - TVS Diode Series Performance Graphs Peak Pulse Power vs. Pulse Time Pulse Waveform 120 1,000 350 W, 8/20 µs Waveform 100 10 0.1 IPP – Peak Pulse Current (% of IPP) PPP – Peak Pulse Current (W) 10,000 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 80 et 60 40 td = t|IPP/2 20 0 1 10 100 1,000 10,000 0 5 15 20 25 30 t – Time (µs) td – Pulse Duration (µs) Block Diagram 10 How to Order BIDIRECTIONAL 1 CD SOD323 - T 12 C - DSL Common Code Chip Diode Package • SOD323 = SOD-323 Package Model T = Transient Voltage Suppressor Working Peak Reverse Voltage 12 = 12 VRWM (Volts) 24 = 24 VRWM (Volts) 2 Suffix C = Bidirectional Diode -DSL = For use in VDSL applications Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOD323-TxxC-DSL - TVS Diode Series Product Dimensions Recommended Footprint This is a molded JEDEC SOD-323 package with lead free 100 % Sn plating on the terminations. It weighs approximately 30 mg and has a flammability rating of UL 94V-0. C A A E B B F D C D H Dimensions (Nominal) A 0.80 (0.031) B 0.80 (0.031) C 1.40 (0.055) D 0.80 (0.031) Dimensions A 1.60 - 1.90 (0.063 - 0.075) B 1.15 - 1.45 (0.045 - 0.057) C 2.39 - 2.70 (0.094 - 0.106) D 0.92 - 1.14 (0.036 - 0.045) E 0.25 - 0.40 (0.010 - 0.016) F 0.08 - 0.20 (0.003 - 0.008) Each device has device marking outlined below. H 0.13 ......... (0.005) MAX. CDSOD323-T12C-DSL ............................................................... 2D CDSOD323-T24C-DSL ................................................................ 4D DIMENSIONS: DIMENSIONS: MM (INCHES) Typical Part Marking MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOD323-TxxC-DSL - TVS Diode Series Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol SOD-323 Carrier Width A 1.55 ± 0.10 (0.061 ± 0.004) Carrier Length B 2.90 ± 0.10 (0.114 ± 0.004) Carrier Depth C 1.35 ± 0.10 (0.053 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 80.0 ... Min. (3.150) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 13.5 . Max. (0.531) -- 3,000 Quantity per Reel MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A. REV. 07/14 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.