05-08-1923

BGA Package
121-Lead (15.00mm × 15.00mm × 3.42mm)
(Reference LTC DWG# 05-08-1923 Rev A)
A
aaa Z
E
Y
X
A2
A1
Z
SEE NOTES
DETAIL A
7
G
SEE NOTES
PIN 1
3
ccc Z
A
PIN “A1”
CORNER
B
4
b
b1
MOLD
CAP
C
D
SUBSTRATE
F
F
Z
// bbb Z
D
E
H1
H2
G
DETAIL B
H
Øb (121 PLACES)
J
ddd M Z X Y
eee M Z
e
K
L
aaa Z
11
PACKAGE TOP VIEW
DETAIL B
PACKAGE SIDE VIEW
DETAIL A
9
8
7
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
6.350
5.080
3.810
2.540
1.270
0.000
0.3175
0.3175
1.270
2.540
3.810
5.080
6.350
10
6.350
0.635 ±0.025 Ø 121x
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
0.27
2.45
NOM
3.42
0.60
2.82
0.75
0.63
15.00
15.00
1.27
12.70
12.70
0.32
2.50
MAX
3.62
0.70
2.92
0.90
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 121
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 121 1112 REV A
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