05-08-1925

BGA Package
38-Lead (11.25mm × 9.00mm × 4.92mm)
(Reference LTC DWG # 05-08-1925 Rev A)
A
aaa Z
E
Y
Z
A2
X
SEE NOTES
7
PIN 1
3
A1
A
ccc Z
PIN “A1”
CORNER
SEE NOTES
DETAIL A
G
b
B
4
C
D
b1
MOLD
CAP
D
F
E
SUBSTRATE
0.27 – 0.37
// bbb Z
aaa Z
G
H
DETAIL B
7
PACKAGE TOP VIEW
Øb (38 PLACES)
DETAIL B
PACKAGE SIDE VIEW
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.810
2.540
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.270
0.3175
0.3175
1.270
2.540
0.000
ddd M Z X Y
eee M Z
3.810
F
e
3.95 – 4.05
4.445
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
SUGGESTED PCB LAYOUT
TOP VIEW
5. PRIMARY DATUM -Z- IS SEATING PLANE
DIMENSIONS
4.1275
4.7625
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
NOM
4.92
0.60
4.32
0.75
0.63
11.25
9.0
1.27
8.89
7.62
MAX
5.12
0.70
4.42
0.90
0.66
NOTES
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 38
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 38 1212 REV A
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