MMIC packaging solutions Teledyne Labtech has developed an innovative low cost custom packaging solution combining our established microwave printed circuit board techniques with the use of low cost organic materials for single chip & MCM applications. We have also developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimisation of short bond wire lengths ensures minimal loss of chip performance. Our low cost package technique offers significant flexibility, enabling us to adapt solutions for a wide range of MMIC designs, cavity dimensions and flexible footprint options. The total microwave package is complimented with our specialist in-house design, assembly and test capabilities. • • • • • • • • Single chip & MCM solutions Competitive pricing for high and low volume quantities Excellent thermal performance Excellent RF performance at Ka band Low cost tooling and short lead times for new designs Perfect for auto assembly process Available as SMD, Flip Chip, BGA, drop in and flange configurations Flexible footprint and cavity changes available Typical power package performance Characteristic Unit Typical Value Insertion loss (per port) @ 40 GHz dB 0.25 Return loss @ 40 GHz dB 15 Isolation (input to output) @ 40 GHz dB 40 Power dissipation (DC equivalent) W 7 SMT assembly temperature ˚C 250 Substrate material – RO4350 / RO4003 / LCP Typical power package dimensions (mm) 5.08 Teledyne Labtech Limited 8 Vincent Avenue Crownhill Milton Keynes MK8 0AB UK 5.08 Plugged via Cavity depth 0.1mm to 0.2mm Tel: +44 (0) 1908 261755 Fax: +44 (0) 1908 261788 www.teledynelabtech.com [email protected] LMW 01/11