CI160808 (0603)

MATERIAL DATA SHEET
Material
CI160808 Series
Product Line
Multilayer Chip Bead
Date
04-December-2004
NO.
Construction
element
Material group
Material
Weight (g)
Materials
CAS
If applicable
Average mass
(%)
1
Ceramic Body
Ceramic
0.0024
SiO2
------
100
Al2O3
------
Business
Confidential
100
2
Terminal
3
Sum (%)
0.00003
Ag
7440-22-4
1
Solder Barrier
Terminal
Electrode
Nickel
0.00003
Ni
7440-02-0
1
4
Solder
Tin
0.00003
Sn
7440-31-5
1
100
5
Circuit
Silver
0.00051
Ag
7440-22-4
17
100
Total weight
0.003
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