CS160808 (0603)

MATERIAL DECLARATION
Material Number
CM160808 Series
Product Line
Chip Inductor
Compliance Date
January 11, 2013
RoHS Compliant
Yes
No.
Construction Element
(subpart)
MSL
Homogeneous
Material
1
Material
weight
[mg]
1
Core
Alumina
2.39
2
Outer Packaging Resin
Epoxy Resin
0.1
3
4
5
Coil / Electrode
Electrode base-Plating
Electrode Plating
Cu plating
Ni Plating
Sn Plating
Total weight
1.26
0.0044
0.1226
3.877
Homogeneous
Material\
Substances
Aluminum Oxide
Manganese Oxide
Crystalline Silica
Chromium (III) Oxide
Titanium Dioxide
Others
Epoxy Resin
Epoxy Resin
Silica
Others
Copper
Nickel
Tin
CASRN
if applicable
Materials
Mass %
1344-28-1
1313-13-9
14808-60-7
1308-38-9
13463-67-7
29690-82-2
25068-38-6
14808-82-2
7440-50-8
7440-02-0
7440-31-5
87.67
3.44
3.00
2.30
3.00
0.59
14.00
13.00
68.00
5.00
100.00
100.00
100.00
Material
Mass % of
total unit wt.
54.04
2.12
1.85
1.42
1.85
0.36
0.36
0.34
1.75
0.13
32.50
0.11
3.16
Subpart
mass of
total wt. (%)
61.28
2.94
32.50
0.11
3.16
This Document was updated on: 2013/1/11
Important remarks: It is the responsibility of the user to verify they are accessing the latest version.
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