CVH

T
PL
IA
N
OM
Features
Applications
n Monolithic construction offering high n DC/DC converters for:
- Smart phones
- DVCs / DSCs
- Tablets
- HDDs / SSDs
- Mobile electronic devices
LE
AD
F
RE
E
*R
oH
S
C
reliability
n Magnetically shielded construction
providing low radiation
n Low DC resistance
n Low profile, 1008 size (2.5 x 2 x 0.9 mm)
n RoHS compliant*
CVH252009 Series Multilayer Power Chip Inductors
Bourns® Part No.
General Specifications
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR IA E
NT
*
Electrical Specifications
Inductance @ 1 MHz
SRF
(MHz)
DCR
(Ohms)
Max.
IDC
(mA)
L (µH)
Tol.
Typ.
CVH252009-R47M
0.47
±20 %
100
0.04
1800
CVH252009-1R0M
1.0
±20 %
60
0.055
1600
CVH252009-1R5M
1.5
±20 %
50
0.07
1500
CVH252009-2R2M
2.2
±20 %
40
0.08
1300
CVH252009-3R3M
3.3
±20 %
30
0.10
1200
CVH252009-4R7M
4.7
±20 %
25
0.11
1100
Operating Temperature
.................................-55 °C to +125 °C
(Temperature rise included)
Storage Temperature
......................+40 °C max. at 70 % RH
Resistance to Soldering Heat
................................................+260 °C
Temperature Rise
.......................... 40 °C at rated current
101
Core...............................................Ferrite
Materials
12.7±0.3
(.500±.012)
Terminal.......................................... Ni/Sn
Packaging........ 3000 pcs. per 7 inch reel
Soldering Profile (Lead Free Solder)
PRE-HEATING
SOLDERING
Product Dimensions
FERRITE
5.0±0.2TERMINAL
ELECTRODE
(.197±.007)
Temperature(°C)
260
12.7±0.3
(.500±.012)
217
200
0.5±0.3
(.020±.012)
2.5±0.2
2.3±0.2
(.098±.008)
(.091±.007)
150
8.5
MAX.
(.335)0.5±0.3
(.020±.012)
25
0.9±0.1
(.035±.004)
60~120
SECONDS
60~150
SECONDS
2.0±0.20
(.079±.008)
Recommended Layout
Time(Seconds)
1.35
(.053)
3.75
(.148) 6.0
(.236)
MM
DIMENSIONS:4.0
(.157)(INCHES)
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Schematic
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
1.75
7.0
(.069)
(.276)
10
L
Inductance (µH)
-4R7M
-3R3M
-2R2M
-1R5M
1
-1R0M
-R47M
0.1
CVH252009 Series Multilayer Power Chip Inductors
L vs. Idc
1000
10000
L
-4R7M
-3R3M
-3R3M
Inductance (µH)
Inductance (µH)
100
DC Current (mA)
10
L
-4R7M
-2R2M
-1R5M
-1R0M
-R47M
0.1
10
L vs. Frequency
10
1
1
-2R2M
-1R5M
1 -1R0M
-R47M
0.1
1
10
1000
100
10000
1
10
100
Frequency (MHz)
DC Current (mA)
Packaging Specifications
10
-4R7M
DIA.
178±1.0
(7.008±.039)
L
2.0±0.5
(.079±.020)
12.0±0.15
(.472±.006)
Inductance (µH)
-3R3M
-2R2M
13.0±0.2
(.512±.008)
DIA.
-1R5M
1 -1R0M
60.0+0.5/-0.0
(2.362+.020/-0)
-R47M
0.1
13.0±0.2
DIA.
(.512±.008)
1
10
100
Frequency (MHz)
9.0±0.5
(.354±.020)
4.00 ± 0.1
(.157 ± .004)
END
2.00 ± 0.1
(.079 ± .004)
1.75 ± 0.1
(.069 ± .004)
DIA.
1.55 ± 0.05
(.061 ± .002)
0.22 ± 0.05
(.009 ± .002)
START
8.00 ± 0.1
(.315 ± .004)
3.5 ± 0.1
(.138 ± .004)
DIA.
1.00 ± 0.05
(.039 ± .002)
4.00 ± 0.1
(.157 ± .004)
NO COMPONENT
200
(7.874)
MIN.
4.00 ± 0.1
(.157 ± .004)
NO COMPONENT
COMPONENTS
2.80 ± 0.1
(.110 ± .004)
400
(15.748)
MIN.
1.35 ± 0.1
(.053 ± .004)
DIMENSIONS:
MM
(INCHES)
USER DIRECTION OF FEED
3000 pcs. per reel
REV. 04/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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