cw160808

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ 0603 size
■ Mobile phones
■ Available in E12 series
■ Cellular phones
■ High Q - up to 80 typ.
■ CTV, VCR, HIC, FDD
■ High operating temperature of 125 °C
■ Small size of only 1.6 mm
■ RoHS compliant*
CW160808 Series - High Q Chip Inductors
Electrical Specifications
General Specifications
Inductance
®
Bourns Part No.
Q
Test Freq.
(MHz)
SRF
(MHz)
RDC
I rms
(mA)
nH
Tol. %
Min.
L
Q
Min.
Ohms
Max.
CW160808-1N8M
1.8
±20
16
250
250
6000
0.04
700
CW160808-2N2D
2.2
±15
16
250
250
6000
0.08
700
CW160808-3N9J
3.9
±5
16
250
250
6000
0.08
700
CW160808-4N7J
4.7
±5
16
250
250
5800
0.10
700
CW160808-6N8J
6.8
±5
25
250
250
5800
0.11
700
CW160808-8N2J
8.2
±5
30
250
250
5000
0.11
700
CW160808-10NJ
10
±5
30
250
250
4800
0.13
700
CW160808-12NJ
12
±5
30
250
250
4000
0.13
700
CW160808-15NJ
15
±5
30
250
250
4000
0.17
700
CW160808-18NJ
18
±5
30
250
250
3100
0.17
700
CW160808-22NJ
22
±5
35
250
250
3000
0.19
700
CW160808-27NJ
27
±5
35
250
250
2800
0.22
600
CW160808-33NJ
33
±5
35
250
250
2300
0.22
600
CW160808-39NJ
39
±5
35
250
250
2200
0.25
600
CW160808-47NJ
47
±5
35
200
250
2100
0.28
600
CW160808-56NJ
56
±5
35
200
250
1900
0.31
600
CW160808-68NJ
68
±5
35
200
250
1700
0.34
600
CW160808-72NJ
72
±5
34
200
250
1700
0.49
400
CW160808-82NJ
82
±5
34
150
250
1700
0.54
400
CW160808-R10J
100
±5
34
150
250
1400
0.71
400
CW160808-R12J
120
±5
32
150
250
1350
0.79
300
CW160808-R15J
150
±5
28
150
150
1300
0.92
280
CW160808-R18J
180
±5
25
100
100
990
1.25
240
CW160808-R22J
220
±5
25
100
100
990
1.90
200
CW160808-R27J
270
±5
25
100
100
990
2.30
170
Materials
Core Material .............................Alumina
(1CC150707-302291)
Wire ........ Enameled copper (1W1E180)
Terminal ...........................Mo/Mn+Ni+Au
Encapsulate ......... Epoxy (1EAS-UV300)
Packaging ................. 3,000 pcs. per reel
Product Dimensions
1.0 ± 0.2
(.040 ± .008)
0.35
(.014)
1.65 ± 0.2
(.065 ± .008)
1.05 ± 0.2
(.041 ± .008)
0.35
(.014)
Solder Profile
Temperature
Rising
Area
Preheat
Area
-
4 °C/
Sec.
Max.
-
150~200 °C / 60~120 Sec.
Reflow
Area
20~
40 °C/
Sec.
Max.
Forced Cooling
Area
-
0.35
(.014)
Recommended Layout
-1~5 °C/Sec. Max.
REF.
PEAK TEMP.
260 °C
250
Temperature (°C)
Temperature Rise
.................20 °C max. at rated current
Operating Temperature
................................-40 °C to +125 °C
Storage Temperature
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
.......................... +260 °C, 10 seconds
0.7
(.028)
0.7
REF.
(.028)
230 °C
-
50 SECONDS MAX.
200
REF.
150
70 SECONDS
MAX.
100
DIMENSIONS:
50
0
50
100
150
200
1.2
REF.
(.047)
0.64
(.025)
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MM
(INCHES)
CW160808 Series - High Q Chip Inductors
Packaging Specifications
2.0 ± 0.5
(.079 ± .020)
178.0
(7.00)
DIA.
21.0 ± 0.8
(.827 ± .031)
12.5
(.492)
THICKNESS
0.10
(.004)
MAX.
13.0 ± 0.5
(.512 ± .020)
DIA.
EMBOSSED
CAVITY
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
EMBOSSED
CARRIER
DIMENSIONS:
MM
(INCHES)
8.0
(.315)
10.0
(.393)
REV. 02/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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