PANASONIC XP6534

Composite Transistors
XP06534 (XP6534)
0.2±0.05
For high-frequency amplification
5
0.12+0.05
–0.02
4
5˚
■ Features
0.2±0.1
1.25±0.10
2.1±0.1
6
Unit: mm
(0.425)
Silicon NPN epitaxial planar type
• Two elements incorporated into one package
• Reduction of the mounting area and assembly cost by one half
1
3
2
(0.65) (0.65)
1.3±0.1
2.0±0.1
■ Basic Part Number
0.9±0.1
• 2SC2404 × 2
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
30
V
Collector-emitter voltage (Base open)
VCEO
20
V
Emitter-base voltage (Collector open)
VEBO
3
V
Collector current
IC
15
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0 to 0.1
■ Absolute Maximum Ratings Ta = 25°C
0.9+0.2
–0.1
10˚
1: Emitter (Tr1)
2: Emitter (Tr2)
3: Base (Tr2)
EIAJ: SC-88
4: Collector (Tr2)
5: Base (Tr1)
6: Collector (Tr1)
SMini6-G1 Package
Marking Symbol: 7F
Internal Connection
6
5
Tr2
Tr1
1
4
2
3
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
Conditions
Min
30
Typ
Max
Unit
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
3
Base-emitter voltage
VBE
VCB = 6 V, IE = −1 mA
Forward current transfer ratio
hFE
VCB = 6 V, IE = −1 mA
40
Transition frequency
fT
VCB = 6 V, IE = −1 mA, f = 200 MHz
450
Reverse transfer capacitance
(Common emitter)
Cre
VCB = 6 V, IE = −1 mA, f = 10.7 MHz
Power gain
GP
VCB = 6 V, IE = −1 mA, f = 100 MHz
24
dB
Noise figure
NF
VCB = 6 V, IE = −1 mA, f = 100 MHz
3.3
dB
V
V
720
mV
250

650
MHz
0.8
pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Note) The part number in the parenthesis shows conventional part number.
Publication date: March 2004
SJJ00216BED
1
XP06534
PT  Ta
IC  VCE
Ta = 25°C
100
50
80 µA
8
60 µA
6
40 µA
4
20 µA
80
120
0
160
6
Collector current IC (mA)
−25°C
20
15
10
5
0
0.4
0.8
1.2
1.6
Base-emitter voltage VBE
Collector-emitter saturation voltage VCE(sat) (V)
25°C
Ta = 75°C
2.0
25°C
1
10
600
400
200
−10
Emitter current IE (mA)
−100
Reverse transfer impedance Zrb (Ω)
800
240
Ta = 75°C
180
25°C
−25°C
120
60
10
100
Cre  VCE
2.4
60
40
20
−1
Emitter current IE (mA)
SJJ00216BED
1
Collector current IC (mA)
80
0
− 0.1
160
300
0
0.1
100
VCB = 6 V
f = 2 MHz
Ta = 25°C
100
120
VCE = 6 V
Zrb  IE
120
1 000
Transition frequency fT (MHz)
Ta = 75°C
−25°C
0.01
0.1
80
hFE  IC
1
0.1
40
360
Collector current IC (mA)
VCB = 6 V
Ta = 25°C
2
0
Base current IB (µA)
IC / IB = 10
10
fT  I E
−1
18
100
(V)
1 200
0
− 0.1
12
VCE(sat)  IC
VCE = 6 V
25
4
Collector-emitter voltage VCE (V)
IC  VBE
30
6
0
0
Forward current transfer ratio hFE
40
Reverse transfer capacitance
Cre (pF)
(Common emitter)
0
8
2
2
Ambient temperature Ta (°C)
0
VCE = 6 V
Ta = 25°C
10
Collector current IC (mA)
Collector current IC (mA)
Total power dissipation PT (mW)
150
12
IB = 100 µA
10
200
0
IC  I B
12
250
−10
IC = 1 mA
f = 10.7 MHz
Ta = 25°C
2.0
1.6
1.2
0.8
0.4
0
0.1
1
10
100
Collector-emitter voltage VCE (V)
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
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applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
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2003 SEP