05-08-1905

BGA Package
25-Lead (6.25mm × 6.25mm × 5.01mm)
(Reference LTC DWG # 05-08-1905 Rev B)
A
aaa Z
E
Y
A1
X
Z
SEE NOTES
A2
PIN 1
A
PIN “A1”
CORNER
b
D
B
F
b1
MOLD
CAP
C
e
D
SUBSTRATE
aaa Z
E
H1
5
Z
H2
// bbb Z
PACKAGE TOP VIEW
DETAIL B
2.540
DETAIL A
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
0.3175
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
DIMENSIONS
0.3175
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
1
3
0.630 ±0.025
1.270
2
2. ALL DIMENSIONS ARE IN MILLIMETERS
0.000
1.270
0.3175
0.3175
1.270
2.540
0.000
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
ddd M Z X Y
eee M Z
1.270
4
PACKAGE BOTTOM VIEW
DETAIL B
PACKAGE SIDE VIEW
Øb (25 PLACES)
2.540
7
G
3
ccc Z
4
SEE NOTES
DETAIL A
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
6.25
6.25
1.27
5.08
5.08
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 25
NOTES
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 25 0913 REV B
Similar pages