BGA Package 118-Lead (15mm × 15mm × 3.42mm) (Reference LTC DWG # 05-08-1903 Rev B) Z A M A2 aaa Z SEE NOTES DETAIL A L K J H G F E D C B 7 A 12 11 b A1 ccc Z 10 9 8 b1 MOLD CAP 7 F D SUBSTRATE 6 0.27 – 0.37 5 // bbb Z 2.45 – 2.55 PIN “A1” CORNER 4 DETAIL B 3 4 2 e Øb (118 PLACES) DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW e b SEE NOTES Y E aaa Z 1 ddd M Z X Y eee M Z X PIN 1 G 3 PACKAGE BOTTOM VIEW DETAIL A 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DIMENSIONS 6.9850 0.630 ±0.025 Ø 118x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 2. ALL DIMENSIONS ARE IN MILLIMETERS SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.60 0.60 NOM 3.42 0.60 2.82 0.75 0.63 15.0 15.0 1.27 13.97 13.97 MAX 3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 118 SUGGESTED PCB LAYOUT TOP VIEW NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 118 1112 REV B