05-08-1909

LGA Package
144-Lead (15mm × 15mm × 4.41mm)
(Reference LTC DWG# 05-08-1909 Rev A)
aaa Z
E
X
A
Y
SEE NOTES
DETAIL A
3x, C (0.22 x45°)
G
e
7
b
M
b
L
K
J
H
G
D
MOLD
CAP
SUBSTRATE
E
e
D
Z
bbb Z
4
F
H1
H2
PAD 1
CORNER
F
C
DETAIL B
B
A
aaa Z
PACKAGE TOP VIEW
PADS
SEE NOTES
DIA (0.630) 144x
12
11
10
8
7
6
5
4
3
2
1
DIA 0.630
PAD 1
PACKAGE BOTTOM VIEW
3
eee S X Y
9
DETAIL B
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
6.9850
DETAIL A
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5.7150
DIMENSIONS
4.4450
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
MIN
4.31
0.60
0.36
3.95
NOM
4.41
0.63
15.00
15.00
1.27
13.97
13.97
0.41
4.00
MAX
4.51
0.66
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 144
7
0.46
4.05
0.15
0.10
0.05
TOTAL NUMBER OF LGA PADS: 144
SUGGESTED PCB LAYOUT
TOP VIEW
NOTES
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 144 1112 REV A
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