05-08-1917

FTE Package
38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1917 Rev Ø)
Topside Exposed Pad
38
9.60 – 9.80*
(.378 – .386)
4.75 REF
(.187)
20
6.60 ±0.10
4.50 REF
6.40
2.74
REF (.252)
(.108)
BSC
0.315 ±0.05
SEE NOTE 4
1.05 ±0.10
PIN 1
INDEX
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
1
0.25
REF
19
1.20
(.047)
MAX
0° – 8°
0.50
(.0196)
BSC
0.17 – 0.27
(.0067 – .0106)
TYP
4. TOPSIDE EXPOSED PAD FOR HEAT SINK ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FTE38 TSSOP REV Ø 0112
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