MCP9700/9700A MCP9701/9701A Low-Power Linear Active Thermistor™ ICs Features Description • Tiny Analog Temperature Sensor • Available Packages: SC-70-5, TO-92-3 • Wide Temperature Measurement Range: - -40°C to +125°C • Accuracy: - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701) • Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typ.) MCP9700/9700A - 19.5 mV/°C (typ.) MCP9701/9701A • Wide Operating Voltage Range: - VDD = 2.3V to 5.5V MCP9700/9700A - VDD = 3.1V to 5.5V MCP9701/9701A • Low Operating Current: 6 µA (typ.) • Optimized to Drive Large Capacitive Loads The MCP9700/9700A and MCP9701/9701A family of Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typ.) of operating current. Typical Applications The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typ.) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. • • • • • • Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring Typical Application Circuit VDD VSS PICmicro® ANI MCU Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type VDD Cbypass 0.1 µF 5-Pin SC-70 MCP9700/9700A MCP9701/9701A VDD MCP9700 GND VOUT NC 1 3-Pin TO-92 MCP9700/9701 Only 5 NC 123 GND 2 VOUT 3 4 VDD Bottom View 1 VDD VOUT GND © 2006 Microchip Technology Inc. DS21942C-page 1 MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +125°C Junction Temperature (TJ):................................. 150°C ESD Protection On All Pins (HBM:MM):.... (4 kV:200V) Latch-Up Current at Each Pin: ...................... ±200 mA DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V Operating Current IDD — 6 12 µA Δ°C/ΔVDD — 0.1 — °C/V TA = +25°C TACY — ±1 — °C TA = 0°C to +70°C TACY -2.0 — +2.0 °C MCP9700A/9701A TA = -40°C to +125°C TACY -2.0 — +4.0 °C MCP9700A TA = -10°C to +125°C TACY -2.0 — +4.0 °C MCP9701A TA = 0°C to +70°C TACY -4.0 — +4.0 °C MCP9700/9701 TA = -40°C to +125°C TACY -4.0 — +6.0 °C MCP9700 TA = -10°C to +125°C TACY -4.0 — +6.0 °C MCP9701 Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A TC — 10.0 — mV/°C MCP9700/9700A TC — 19.5 — mV/°C MCP9701/9701A VONL — ±0.5 — °C Output Current IOUT — — 100 µA Output Impedance ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz ΔVOUT/ ΔIOUT — 1 — Ω TA = 0°C to +70°C, IOUT = 100 µA Power Supply Power Supply Rejection MCP9700/9700A MCP9701/9701A Sensor Accuracy (Notes 1, 2) Sensor Output Temperature Coefficient Output Non-linearity Output Load Regulation Note 1: 2: 3: 4: TA = 0°C to +70°C (Note 2) The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC-70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). DS21942C-page 2 © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Turn-on Time Sym Min Typ Max Unit tON — 800 — µs Typical Load Capacitance (Note 3) CLOAD — — 1000 pF SC-70 Thermal Response to 63% tRES — 1.3 — s TO-92 Thermal Response to 63% tRES — 1.65 — s Note 1: 2: 3: 4: Conditions 30°C (Air) to +125°C (Fluid Bath) (Note 4) The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC-70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). M TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions TA -40 — +125 °C MCP9700/9700A (Note) TA -10 — +125 °C MCP9701/9701A (Note) Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, SC-70-5 θJA — 331 — °C/W Thermal Resistance, TO-92-3 θJA — 131.9 — °C/W Temperature Ranges Specified Temperature Range Thermal Package Resistances Note: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2006 Microchip Technology Inc. DS21942C-page 3 MCP9700/9700A and MCP9701/9701A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 4.0 6.0 4.0 MCP9701A VDD= 5.0V 2.0 1.0 Accuracy (°C) Accuracy (°C) 3.0 Spec. Limits 0.0 -1.0 -50 -25 25 50 TA (°C) 75 100 125 0.0 -2.0 -4.0 -25 0 25 50 TA (°C) 75 100 -50 ' Accuracy Due to Load (°C) Accuracy (°C) MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V 2.0 -50 -25 0 25 50 TA (°C) 75 100 125 0.2 MCP9701/MCP9701A VDD = 5.0V 0.1 0 MCP9700/MCP9700A VDD = 3.3V -0.1 ILOAD = 100 µA -0.2 125 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. 12.0 Load Regulation 'V/'I (:) 4.0 10.0 MCP9701 MCP9701A 8.0 IDD (µA) MCP9700 VDD= 3.3V FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). 6.0 MCP9700/ MCP9700A VDD = 5.5V VDD = 2.3V Spec. Limits 0.0 -4.0 0 FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). 4.0 2.0 -2.0 MCP9700A VDD= 3.3V -2.0 MCP9701 VDD= 5.0V 6.0 MCP9700 MCP9700A 4.0 2.0 0.0 3.0 2.0 MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA 1.0 0.0 -50 -25 FIGURE 2-3: Temperature. DS21942C-page 4 0 25 50 TA (°C) 75 100 Supply Current vs. 125 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-6: Load Regulation vs. Ambient Temperature. © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 30% 15% Normalized PSRR (°C/V) Normalized PSRR (°C/V) 0.20 0.15 MCP9700/MCP9700A VDD= 2.3V to 4.0V 0.05 0.00 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-9: Power Supply Rejection (Δ°C/ΔVDD) vs. Ambient Temperature. © 2006 Microchip Technology Inc. 500 480 20.0 19.9 19.8 19.7 FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). 0.30 MCP9700/MCP9700A VDD= 2.3V to 5.5V -50 19.7 TC (mV/°C) FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). 0.10 19.6 19.5 19.4 19.3 MCP9701 MCP9701A VDD = 5.0V 108 samples 19.2 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 19.3 Occurrences 10.5 10.4 10.3 10.2 10.2 10.1 10.0 9.9 9.8 9.8 9.7 Occurrences MCP9700 MCP9700A VDD = 3.3V 108 samples TC (mV/°C) 0.25 460 FIGURE 2-10: Output Voltage at 0°C (MCP9701/9701A). FIGURE 2-7: Output Voltage at 0°C (MCP9700/9700A). 0.30 440 V0°C (mV) V0°C (mV) 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 420 300 600 580 560 540 520 500 480 460 0% 440 5% 0% 420 5% 400 10% 380 10% 20% 360 15% 340 20% 25% MCP9701 MCP9701A VDD = 5.0V 108 samples 320 25% 35% MCP9700 MCP9700A VDD = 3.3V 108 samples 400 Occurrences 30% Occurrences 35% 0.25 MCP9701/MCP9701A VDD= 3.1V to 5.5V 0.20 0.15 0.10 MCP9701/MCP9701A VDD= 3.1V to 4.0V 0.05 0.00 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-12: Power Supply Rejection (Δ°C/ΔVDD) vs. Temperature. DS21942C-page 5 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 1.6 3.0 TA = 26°C 1.4 2.5 1.0 VOUT (V) 0.8 0.6 0.4 MCP9701 MCP9701A 2.0 1.5 1.0 MCP9700 MCP9700A 0.5 0.2 0.0 0.0 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -25 Output Voltage vs. Power 2.5 VDD_STEP = 5V TA = 26°C IDD 8 1.7 0.8 VOUT VDD_RAMP = 5V/ms TA = 26°C 125 30.0 18.0 6.0 -6.0 VOUT 1.0 -18.0 0.5 -30.0 0.0 -42.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) Time (ms) Output vs. Settling Time to FIGURE 2-17: Ramp VDD. 130 Output vs. Settling Time to SC70-5 1 in. x 1 in. Copper Clad PCB 80 Leaded, without PCB SC70-5 TO92-3 55 30 Output Impedance (:) 1000 105 TA (°C) 100 2.0 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -2.5 -0.1 -1.7 0 FIGURE 2-14: step VDD. 75 1.5 -0.8 2 IDD 2.5 0.0 4 50 Output Voltage vs. Ambient 3.0 VOUT (V) 6 VOUT (V) FIGURE 2-16: Temperature. IDD (mA) 12 10 25 TA (°C) VDD (V) FIGURE 2-13: Supply. 0 IDD (µA) VOUT (V) 1.2 VDD = 5.0V IOUT = 100 µA TA = 26°C 100 10 1 -2 0 2 FIGURE 2-15: Fluid Bath). DS21942C-page 6 4 6 8 10 Time (s) 12 14 16 18 Thermal Response (Air to 0.1 0.1 FIGURE 2-18: Frequency. 1 1 10 100 1K 10 100 1000 Frequency (Hz) 10K 100K 10000 100000 Output Impedance vs. © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. SC-70 Pin No. TO-92 Symbol 1 — NC 2 3 GND Power Ground Pin 3 2 VOUT Output Voltage Pin 4 1 VDD Power Supply Input 5 — NC No Connect 3.1 Function No Connect Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V . 3.3 Power Supply Input (VDD) The operating voltage as specified in the “DC Electrical Characteristics” table is applied to VDD. © 2006 Microchip Technology Inc. DS21942C-page 7 MCP9700/9700A and MCP9701/9701A APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 125°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typ.) for the MCP9700/9700A and 19.5 mV/°C (typ.) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typ.) and 400 mV (typ.) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1. EQUATION 4-1: For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typ.) accuracy over the operating temperature (Figure 4-2). 6.0 100 Samples 4.0 Accuracy (°C) 4.0 SENSOR TRANSFER FUNCTION 2.0 Spec. Limits 0.0 + V Average - V -2.0 V OUT = T C • T A + V 0°C -4.0 -50 -25 Where: TA = Ambient Temperature FIGURE 4-2: Sensor Accuracy. V0°C = Sensor Output Voltage at 0°C Improving Accuracy The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typ.) from 0°C to +70°C, as shown in Figure 4-1. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. 3.0 Accuracy (°C) 2.0 1.0 0.0 -1.0 -3.0 -25 FIGURE 4-1: vs. Temperature. 0 25 50 TA (°C) 75 100 125 Relative Accuracy to +25°C The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. DS21942C-page 8 4.2 75 100 125 MCP9700/9700A Calibrated Shutdown Using Microcontroller I/O Pin The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 µA (typ.) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 VDD= 3.3V 10 Samples -50 50 The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. TC = Temperature Coefficient -2.0 25 Temperature (°C) VOUT = Sensor Output Voltage 4.1 0 Layout Considerations The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. However, the plastic device package insulates the die and restricts device thermal response. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, the PCB needs to be designed with proper thermal conduction to the sensor pins. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELFHEATING T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT ) Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. © 2006 Microchip Technology Inc. DS21942C-page 9 MCP9700/9700A and MCP9701/9701A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC-70 (MCP9700/MCP9700A) XXN (Front) YWW (Back) Device Example: Code MCP9700/9700A AUN MCP9701/9701A AVN AU2 (Front) 622 (Back) Note: Applies to 5-Lead SC-70. 5-Lead SC-70 (MCP9701/MCP9701A) XXNN Device Example: Code MCP9700/9700A AUNN MCP9701/9701A AVNN AV25 Note: Applies to 5-Lead SC-70. 3-Lead TO-92 (MCP9700/MCP9701) XXXXXX XXXXXX XXXXXX YWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS21942C-page 10 Example MCP 9700E e3 TO^^ 622256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 5-Lead Plastic Small Outline Transistor (LT) (SC-70) E E1 D p B n 1 Q1 A2 c A1 L Units Dimension Limits A MILLIMETERS* INCHES MIN NOM MAX MIN NOM MAX Pitch n p Overall Height A .031 .043 0.80 Molded Package Thickness A2 .031 .039 0.80 1.00 Standoff A1 .000 .004 0.00 0.10 Number of Pins 5 5 .026 (BSC) 0.65 (BSC) 1.10 Overall Width E .071 .094 1.80 2.40 Molded Package Width E1 .045 .053 1.15 1.35 Overall Length D .071 .087 1.80 2.20 Foot Length L .004 .012 0.10 0.30 Q1 .004 .016 0.10 0.40 Lead Thickness c .004 .007 0.10 0.18 Lead Width B .006 .012 0.15 0.30 Top of Molded Pkg to Lead Shoulder * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEITA (EIAJ) Standard: SC-70 Drawing No. C04-061 © 2006 Microchip Technology Inc. Revised 07-19-05 DS21942C-page 11 MCP9700/9700A and MCP9701/9701A 3-Lead Plastic Transistor Outline (TO) (TO-92) E1 D n 1 L 1 2 3 α B p c A R Units Dimension Limits n p β INCHES* NOM 3 .050 .130 .143 .175 .186 .170 .183 .085 .090 .500 .555 .014 .017 .016 .019 4 5 2 3 MIN MAX MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 MIN Number of Pins Pitch Bottom to Package Flat A .155 Overall Width E1 .195 Overall Length D .195 Molded Package Radius R .095 Tip to Seating Plane L .610 c Lead Thickness .020 Lead Width B .022 α 6 Mold Draft Angle Top β Mold Draft Angle Bottom 4 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 DS21942C-page 12 MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision C (June 2006) • Added the MCP9700A and MCP9701A devices to data sheet • Added TO92 package for the MCP9700/MCP9701 Revision B (October 2005) The following is the list of modifications: • Added Section 3.0 “Pin Descriptions” • Added the Linear Active Thermistor™ IC trademark • Removed the 2nd order temperature equation and the temperature coeficient histogram • Added a reference to AN1001 and corresponding verbiage • Added Figure 4-2 and corresponding verbiage Revision A (November 2005) • Original Release of this Document. © 2006 Microchip Technology Inc. DS21942C-page 13 MCP9700/9700A and MCP9701/9701A NOTES: DS21942C-page 14 © 2006 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: – X /XX Temperature Range Package MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9700AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E Package: = -40°C to +125°C LT = TO = Examples: a) MCP9700T-E/LT: b) MCP9700-E/TO: c) MCP9700AT-E/LT: a) MCP9701T-E/LT: b) MCP9701-E/TO: c) MCP9701AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC-70 package. Linear Active Thermistor™ IC, 3LD TO-92 package. Linear Active Thermistor™ IC, Tape and Reel, 5LD SC-70 package. Linear Active Thermistor™ IC, Tape and Reel, 5LD SC-70 package. Linear Active Thermistor™ IC, 3LD TO-92 package. Linear Active Thermistor™ IC, Tape and Reel, 5LD SC-70 package. Plastic Small Outline Transistor, 5-lead Plastic Plastic Transistor Outline, 3-lead (MCP9700, MCP9701 only) © 2006 Microchip Technology Inc. DS21942C-page 15 MCP9700/9700A and MCP9701/9701A NOTES: DS21942C-page 16 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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