05-08-1945

BGA Package
32-Lead (22mm × 9mm × 5.06mm)
(Reference LTC DWG# 05-08-1945 Rev Ø)
Z
A
aaa Z
E
Y
X
SEE NOTES
DETAIL A
A2
SEE NOTES
8
7
6
5
4
3
2
7
1
PIN 1
3
A
PIN “A1”
CORNER
4
B
b
A1
C
ccc Z
D
E
F
b1
MOLD
CAP
G
SUBSTRATE
J
K
Z
// bbb Z
H2
D
H
H1
DETAIL B
L
F
M
N
Øb (32 PLACES)
P
ddd M Z X Y
eee M Z
R
S
T
U
V
DETAIL A
W
e
X
aaa Z
e
DETAIL B
PACKAGE SIDE VIEW
0.60 ±0.025 Ø 32x
10.00
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
9.00
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
0.00
9.00
10.00
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
3.50
2.50
1.50
b
G
0.00
0.50
0.50
1.50
3.20
2.50
3.50
3.80
PACKAGE TOP VIEW
9.70
10.30
MIN
4.76
0.40
4.36
0.55
0.55
0.46
3.95
NOM
5.06
0.50
4.56
0.60
0.60
22.0
9.0
1.0
20.0
7.0
0.56
4.00
MAX
5.26
0.60
4.66
0.65
0.65
0.66
4.05
0.15
0.10
0.15
0.15
0.08
TOTAL NUMBER OF BALLS: 32
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 32 0413 REV Ø
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