BGA Package 32-Lead (22mm × 9mm × 5.06mm) (Reference LTC DWG# 05-08-1945 Rev Ø) Z A aaa Z E Y X SEE NOTES DETAIL A A2 SEE NOTES 8 7 6 5 4 3 2 7 1 PIN 1 3 A PIN “A1” CORNER 4 B b A1 C ccc Z D E F b1 MOLD CAP G SUBSTRATE J K Z // bbb Z H2 D H H1 DETAIL B L F M N Øb (32 PLACES) P ddd M Z X Y eee M Z R S T U V DETAIL A W e X aaa Z e DETAIL B PACKAGE SIDE VIEW 0.60 ±0.025 Ø 32x 10.00 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 9.00 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee 0.00 9.00 10.00 SUGGESTED PCB LAYOUT TOP VIEW PACKAGE BOTTOM VIEW 3.50 2.50 1.50 b G 0.00 0.50 0.50 1.50 3.20 2.50 3.50 3.80 PACKAGE TOP VIEW 9.70 10.30 MIN 4.76 0.40 4.36 0.55 0.55 0.46 3.95 NOM 5.06 0.50 4.56 0.60 0.60 22.0 9.0 1.0 20.0 7.0 0.56 4.00 MAX 5.26 0.60 4.66 0.65 0.65 0.66 4.05 0.15 0.10 0.15 0.15 0.08 TOTAL NUMBER OF BALLS: 32 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 32 0413 REV Ø