05-08-1889

BGA Package
51-Lead (15.00mm × 9.00mm × 4.92mm)
(Reference LTC DWG# 05-08-1889 Rev Ø)
A
aaa Z
E
Y
X
Z
DETAIL A
A2
A1
G
SEE NOTES
PIN 1
3
ccc Z
A
PIN “A1”
CORNER
B
4
b
b1
MOLD
CAP
C
D
SUBSTRATE
F
F
Z
// bbb Z
D
E
H1
H2
G
DETAIL B
H
Øb (51 PLACES)
J
e
ddd M Z X Y
eee M Z
K
L
aaa Z
7
PACKAGE TOP VIEW
DETAIL A
DIMENSIONS
6.350
0.630 ±0.025 Ø 51x
5.080
3.810
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
5
4
3
2
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.810
2.540
1.270
0.000
0.3175
0.3175
1.270
2.540
3.810
DETAIL B
PACKAGE SIDE VIEW
6
PACKAGE BOTTOM VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.71
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.78
0.63
15.00
9.00
1.27
12.70
7.62
0.32
4.00
MAX
5.12
0.70
4.42
0.85
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 51
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 51 1110 REV Ø
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