CAY10-J2

MATERIAL DECLARATION SHEET
Material Number
CAY10-J2 (LF)
Product Line
Chip Resistor Array
Compliance Date
2012/7/18
RoHS Compliant
YES
No.
Construction
Element(subpart)
MSL
1
Homogeneous
Material
Material weight
[g]
Ceramic
0.00081889714
1
Ceramic Substrate
2
Conductor Layer
Other
0.00003907386
3
Resistive Element
Other
0.00002594587
Over-Coating
Paint
0.00002470543
5
End Terminal
Metal
0.00003700646
6
Ni Plating
Metal
0.00004837716
7
Tin Plating
Metal
0.00003969408
Total weight
0.0010337
4
This Document was updated on:
Homogeneo
us Material\
Substances
Aluminum
oxide
Silicon
dioxide
Silver
if applicable
Materials
Mass %
Material Mass
% of total unit
wt.
1344-28-1
96%
76.05%
14808-60-7
4%
3.17%
7440-22-4
95%
3.59%
Glass
Ruthenium
dioxide
Silver
Palladium
65997-18-4
5%
0.19%
12036-10-1
25%
0.63%
7440-22-4
7440-05-3
40%
15%
1%
0.38%
Lead oxide
1317-36-8
20%
0.5%
Epoxy
25068-38-6
100%
2.39%
Nickel
Chromium
Nickel
7440-02-0
7440-47-3
7440-02-0
80%
20%
100%
2.86%
0.72%
4.68%
2.86%
Tin
7440-31-5
100%
3.84%
3.84%
CAS
Subpart mass
of total wt. (%)
79.22%
3.78%
2.01%
2.89%
5.4%
2012/7/23
Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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