& *R AE oH C- S C Q2 O 00 MP QU LI AL ANT IF IE D Features Applications ■ Special alloy resistor ■ Power supplies ■ Power rating at 70 °C: 3 W ■ Stepper motor drives ■ Inductance less than 5 nH ■ Input amplifiers ■ RoHS compliant* ■ AEC-Q200 qualified, automotive grade CRA2512 - High Power Current Sense Chip Resistor Electrical Characteristics Recommended Solder Pad Layout Characteristic L CRA2512 Power Rating @ 70 °C 3W Operating Temperature Range -55 °C to +170 °C Derated to Zero Load at +170 °C Maximum Working Current (P / R)1/2 Insulation Resistance > 100 megohms Resistance Range 0.010 - 0.100 Ω A Cu TRACE SENSING TRACE Resistance Tolerance ±1 %, ±5 % Model Temperature Coefficient ±75 PPM/°C CRA2512 Thermal Shock Short Time Overload Low Temperature Storage High Temperature Exposure Bias Humidity Mechanical Shock Vibration Load Life Resistance to Solder Heat Moisture Resistance A Conditions -55 ˚C to + 150 ˚C, 1000 Cycles, 15 minutes 5 X Rated Power for 5 seconds Specification ΔR < ±0.5 % -55 ˚C for 24 hours ΔR < ±0.5 % 1000 hours @ + 170 ˚C ΔR < ±1.0 % + 85 ˚C, 85 % RH, 10 % Bias, 1000 hours 100 g’s for 6 milliseconds, 5 pulses Frequency varied 10 to 2000 KHz in one minute, 3 directions, 12 hours 1000 hours at rated power at +70 ˚C, 1.5 hours on, 0.5 hours off +260 ˚C Solder, 10-12 second dwell, 25 mm/second emergence MIL-STD-202 Method 106, 0 % power (7a and 7b not required) ΔR < ±0.5 % B 4.0 (0.157) DIMENSIONS: Performance Characteristics Test B L 2.1 4.1 (0.083) (0.161) MM (INCHES) Construction ΔR < ±0.5 % Overcoat Ni / Sn Plating Metal Alloy Plate ΔR < ±0.5 % ΔR < ±0.5 % ΔR < ±1.0 % ΔR < ±0.5 % ΔR < ±0.5 % Product Dimensions A T B C C Model CRA2512 C C A B C T Resistor Material 6.45 ± 0.20 (0.254 ± 0.008) 3.35 ± 0.20 (0.131 ± 0.008) 0.95 ± 0.10 (0.037 ± 0.004) 0.7 ± 0.20 (0.0276 ± 0.008) Resistor Cu-Ni or Cu-Mn *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. DIMENSIONS: MM (INCHES) CRA2512 - High Power Current Sense Chip Resistor Packaging Dimensions (Conforms to EIA RS-481A) EMBOSSED TAPE 1.5 (0.059) DIA. MIN. 1.5 +0.1/-0 DIA. (0.059 +0.004/-0) TOP TAPE 1.75 ± 0.1 (0.069 ± 0.004) 5.5 ± 0.05 (0.217 ± 0.002) 13.0 ± 1.0 (0.512 ± 0.039) DIA. 180 +0/-3 (7.09 +0/-0.118) DIA. 12.0 ± 0.2 (0.472 ± 0.008) 6.9 ± 0.2 (0.272 ± 0.008) 4.0 ± 0.05 (0.157 ± 0.002) RESISTOR 3.60 ± 0.20 (0.142 ± 0.008) 4.0 ± 0.1 (0.157 ± 0.004) 1.2 ± 0.15 (0.047 ± 0.006) 60.0 (2.362) MIN. DIA. 2.0 ± 0.05 (0.079 ± 0.002) USER DIRECTION OF FEED DIMENSIONS: Code R Value Code R Value R010 0.010 R050 0.050 R015 0.015 R060 0.060 R020 0.020 R070 0.070 R025 0.025 R075 0.075 R030 0.030 R080 0.080 R040 0.040 R100 0.100 Consult factory for other resistance values. 13.0 ± 1.0 (0.512 ± 0.039) Soldering Profile Can be soldered in accordance with IPC/JEDEC-J-STD-020. 275 <1> Maximum of 20 seconds between 260 °C peak +255 °C and +260 °C <1> 255 °C 225 220 °C Temperature (°C) CRA2512 Resistance Values Available 15.4 ± 2.0 (0.606 ± 0.079) MM (INCHES) 190 °C 175 90 - 150 seconds Ramp Down 6 °C/second 150 °C 125 60 - 120 seconds Derating Curve 10 seconds minimum Power Ratio (%) 75 Ramp Up 3 °C/second maximum 100 25 0 -55 70 50 100 150 Time (seconds) 200 250 300 170 Ambient Temperature (°C) How to Order CRA 2512 - F Z - R020 E LF REV. 09/15 Model (CRA = Precision Chip Resistor Size 2512 = 2512 Size Resistance Tolerance • F = ±1 % • J = ±5 % TCR (PPM/°C) • Z = ±75 PPM/°C Resistance Value “R” (decimal point) followed by three significant digits (example: R025 = 0.025 ohm) Packaging • E = 4000 pieces on 180 mm (7 inch) reel Termination • LF = Tin-plated (RoHS compliant) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.