MATERIAL DECLARATION SHEET Material Number CHV Series Product Line Thick film high voltage chip resistors Compliance Date 2013-06-19 RoHS Compliant Yes (Lead Exemption) No. 1 Construction Element(subpart) Ceramic MSL Homogeneous Material Substrate 1 Material weight [mg ] 8.588 Homogeneous Material\ Substances if applicable Materials Mass % Material Mass % of total unit wt. Aluminum oxide 1344-28-1 96 81.946 Silicon dioxide 7631-86-9 Magnesium oxide 1309-48-4 CASRN Subpart mass of total wt. (%) 85.36 4 3.414 2 Top conductor Silver 0.1620 Silver 7440-22-4 100 1.610 1.610 3 Bottom conductor Silver 0.0543 Silver 7440-22-4 100 0.540 0.540 65997-18-4 75 0.810 12036-10-1 25 0.270 65997-18-4 92 0.949 1308-38-9 8 0.083 Epoxy resin 25036-25-3 100 2.313 Silver 7440-22-4 85 1.978 Phenolic resin 9003-36-5 15 0.349 4 Resistor Ruthenium glass 0.1087 5 First encapsulating Glass 0.1038 6 Overcoat Epoxy resin 0.2327 7 Side conductor Silver 0.2341 Headquarters Riverside CA Lead-containing glass* Ruthenium dioxide Glass Chromium III oxide 1.080 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society 1.032 2.313 2.327 page 1 of 2 MATERIAL DECLARATION SHEET 8 Plating (Middle) Nickel 0.1985 Nickel 7440-02-0 100 1.973 1.973 9 Plating (Outer) Tin 0.3573 Tin 7440-31-5 100 3.551 3.551 10 Marking Epoxy 0.0215 Epoxy 25068-38-6 70 0.150 Titanium IV oxide 1317-80-2 30 0.064 Total weight 10.0609 This Document was updated on: 0.214 06/19/2013 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * Exemption 7c-I – Electrical and electronic components containing lead in a glass or ceramic …. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2