05-08-1969

BGA Package
144-Lead (16mm × 16mm × 5.01mm)
(Reference LTC DWG # 05-08-1969 Rev Ø)
Z
A
A2
aaa Z
SEE NOTES
DETAIL A
M
L
K
J
H
G
F
E
D
C
B
7
A
1
PIN “A1”
CORNER
4
PIN 1
2
A1
b
ccc Z
3
4
5
b1
MOLD
CAP
6
F
D
7
SUBSTRATE
H1
8
Z
// bbb Z
H2
9
DETAIL B
10
11
e
Øb (144 PLACES)
e
b
Y
E
aaa Z
12
ddd M Z X Y
eee M Z
X
SEE NOTES
G
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
3
PACKAGE BOTTOM VIEW
DIMENSIONS
6.9850
0.630 ±0.025 Ø 144x
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE
DETAIL A
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
16.00
16.00
1.27
13.97
13.97
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 144
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 144 0114 REV Ø
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