DE12(10) Package 12-Lead Plastic DFN (4mm × 3mm) Variation DE12(10) with 2 Pins Removed. Flip Chip (Reference LTC DWG # 05-08-1971 Rev Ø) 0.70 ±0.05 0.25 ±0.05 3.60 ±0.05 2.10 ±0.05 3.55 ±0.05 2.20 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.40 ±0.10 4.00 ±0.10 (2 SIDES) PIN 1 TOP MARK (NOTE 5) 0.200 REF 7 3.00 ±0.10 (2 SIDES) 12 0.2 ±0.05 1.00 REF 3.55 ±0.10 0.50 ±0.05 0.75 ±0.05 6 1 0.25 ±0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD 0.00 – 0.05 NOTE: 1. DRAWING NOT TO SCALE 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UE12(10) DFN 0314 REV O