05-08-1972

BGA Package
66-Lead (22mm × 15mm × 5.16mm)
(Reference LTC DWG# 05-08-1972 Rev Ø)
Z
A
aaa Z
E
Y
SEE NOTES
A2
X
11
3
10
9
8
7
6
5
4
3
2
7
1
A
A1
B
ccc Z
PIN “A1”
CORNER
SEE NOTES
DETAIL A
b
4
PIN 1
C
D
E
b1
MOLD
CAP
F
SUBSTRATE
// bbb Z
H
F
Z
H2
D
G
H1
J
DETAIL B
K
L
M
Øb (66 PLACES)
N
ddd M Z X Y
eee M Z
P
R
e
S
T
aaa Z
e
DETAIL A
DETAIL B
PACKAGE SIDE VIEW
8.8900
7.6200
6.3500
5.0800
3.8100
2.5400
1.2700
0.00
1.2700
2.5400
3.8100
5.0800
6.3500
7.6200
8.8900
10.1600
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
10.1600
0.630 ±0.025 Ø 66x
b
G
6.3500
5.0800
3.8100
2.5400
1.2700
0.00
1.2700
2.5400
3.8100
5.0800
6.3500
PACKAGE TOP VIEW
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.91
0.50
4.41
0.60
0.60
0.46
3.95
NOM
5.16
0.60
4.56
0.75
0.63
22.00
15.00
1.27
20.32
12.70
0.56
4.00
MAX
5.41
0.70
4.71
0.90
0.66
0.66
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 66
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 66 0314 REV Ø
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