LWE Package 64-Lead Plastic Exposed Pad LQFP (10mm × 10mm) (Reference LTC DWG #05-08-1982 Rev Ø) 10.15 – 10.25 7.50 REF 1 64 49 48 0.50 BSC 5.74 ±0.05 7.50 REF 0.20 – 0.30 10.15 – 10.25 5.74 ±0.05 16 17 PACKAGE OUTLINE 33 32 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 12.00 BSC 10.00 BSC 5.74 ±0.10 64 49 SEE NOTE: 3 1 64 49 48 48 1 12.00 BSC 10.00 BSC A 5.74 ±0.10 A 16 33 33 16 C0.30 – 0.50 17 32 17 BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA) 32 11° – 13° 1.60 1.35 – 1.45 MAX R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° LWE64 0614 REV Ø 11° – 13° 0.09 – 0.20 1.00 REF 0.50 BSC 0.17 – 0.27 0.05 – 0.15 SIDE VIEW 0.45 – 0.75 SECTION A – A NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER 4. DRAWING IS NOT TO SCALE