05-08-1982

LWE Package
64-Lead Plastic Exposed Pad LQFP (10mm × 10mm)
(Reference LTC DWG #05-08-1982 Rev Ø)
10.15 – 10.25
7.50 REF
1
64
49
48
0.50 BSC
5.74 ±0.05
7.50 REF
0.20 – 0.30
10.15 – 10.25
5.74 ±0.05
16
17
PACKAGE OUTLINE
33
32
1.30 MIN
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
12.00 BSC
10.00 BSC
5.74 ±0.10
64
49
SEE NOTE: 3
1
64
49
48
48
1
12.00 BSC
10.00 BSC
A
5.74 ±0.10
A
16
33
33
16
C0.30 – 0.50
17
32
17
BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA)
32
11° – 13°
1.60
1.35 – 1.45 MAX
R0.08 – 0.20
GAUGE PLANE
0.25
0° – 7°
LWE64 0614 REV Ø
11° – 13°
0.09 – 0.20
1.00 REF
0.50
BSC
0.17 – 0.27
0.05 – 0.15
SIDE VIEW
0.45 – 0.75
SECTION A – A
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
4. DRAWING IS NOT TO SCALE
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